Kim, Jong-Min, Yasuda, Kiyokazu, Rito, Masahiro, Fujimoto, Kozo (2004) New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers. MATERIALS TRANSACTIONS, 45 (1). 157-160 doi:10.2320/matertrans.45.157
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers | ||
| Journal | MATERIALS TRANSACTIONS | ||
| Authors | Kim, Jong-Min | Author | |
| Yasuda, Kiyokazu | Author | ||
| Rito, Masahiro | Author | ||
| Fujimoto, Kozo | Author | ||
| Year | 2004 | Volume | 45 |
| Issue | 1 | ||
| Publisher | Japan Institute of Metals | ||
| DOI | doi:10.2320/matertrans.45.157Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 7777186 | Long-form Identifier | mindat:1:5:7777186:7 |
| GUID | 0 | ||
| Full Reference | Kim, Jong-Min, Yasuda, Kiyokazu, Rito, Masahiro, Fujimoto, Kozo (2004) New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers. MATERIALS TRANSACTIONS, 45 (1). 157-160 doi:10.2320/matertrans.45.157 | ||
| Plain Text | Kim, Jong-Min, Yasuda, Kiyokazu, Rito, Masahiro, Fujimoto, Kozo (2004) New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers. MATERIALS TRANSACTIONS, 45 (1). 157-160 doi:10.2320/matertrans.45.157 | ||
| In | (2004) MATERIALS TRANSACTIONS Vol. 45 (1) Japan Institute of Metals | ||
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