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Chang, Tao-Chih, Hon, Min-Hsiung, Wang, Moo-Chin (2004) Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface. MATERIALS TRANSACTIONS, 45 (3). 606-613 doi:10.2320/matertrans.45.606

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Reference TypeJournal (article/letter/editorial)
TitleThermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface
JournalMATERIALS TRANSACTIONS
AuthorsChang, Tao-ChihAuthor
Hon, Min-HsiungAuthor
Wang, Moo-ChinAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.606Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777364Long-form Identifiermindat:1:5:7777364:3
GUID0
Full ReferenceChang, Tao-Chih, Hon, Min-Hsiung, Wang, Moo-Chin (2004) Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface. MATERIALS TRANSACTIONS, 45 (3). 606-613 doi:10.2320/matertrans.45.606
Plain TextChang, Tao-Chih, Hon, Min-Hsiung, Wang, Moo-Chin (2004) Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface. MATERIALS TRANSACTIONS, 45 (3). 606-613 doi:10.2320/matertrans.45.606
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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Chang, Tao-Chih, Wang, Moo-Chin, Hon, Min-Hsiung (2005) Growth and morphology of the intermetallic compounds formed at the Sn–9Zn–2.5Ag/Cu interface. Journal of Alloys and Compounds, 402. 141-148 doi:10.1016/j.jallcom.2005.04.141
Hon, Min-Hsiung, Chang, Tao-Chih, Wang, Moo-Chin (2008) Phase transformation and morphology of the intermetallic compounds formed at the Sn–9Zn–3.5Ag/Cu interface in aging. Journal of Alloys and Compounds, 458. 189-199 doi:10.1016/j.jallcom.2007.04.004
Liu, Chih-Yao, Chen, Ying-Ru, Li, Wang-Long, Hon, Min-Hsiung, Wang, Moo-Chin (2007) Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface. MATERIALS TRANSACTIONS, 48 (8). 2133-2138 doi:10.2320/matertrans.mra2007075
Chang, Tao-Chih, Hon, Min-Hsiung, Wang, Moo-Chin (2003) Intermetallic compounds formation and interfacial adhesion strength of Sn–9Zn–0.5Ag solder alloy hot-dipped on Cu substrate. Journal of Alloys and Compounds, 352. 168-174 doi:10.1016/s0925-8388(02)01122-2
Chang, Tao-Chih, Wang, Jian-Wen, Wang, Moo-Chin, Hon, Min-Hsiung (2006) Solderability of Sn–9Zn–0.5Ag–1In lead-free solder on Cu substrate. Journal of Alloys and Compounds, 422. 239-243 doi:10.1016/j.jallcom.2005.09.094
Chang, Tao-Chih, Wang, Moo-Chin, Hon, Min-Hsiung (2003) Crystal growth of the intermetallic compounds at the Sn–9Zn–xAg/Cu interface during isothermal aging. Journal of Crystal Growth, 252 (1). 401-412 doi:10.1016/s0022-0248(02)02480-6
Chang, Tao-Chih, Wang, Moo-Chin, Hon, Min-Hsiung (2003) Effect of aging on the growth of intermetallic compounds at the interface of Sn–9Zn–xAg/Cu substrates. Journal of Crystal Growth, 250 (1). 236-243 doi:10.1016/s0022-0248(02)02252-2
Chang, Tao-Chih, Hsu, Ying-Tun, Hon, Min-Hsiung, Wang, Moo-Chin (2003) Enhancement of the wettability and solder joint reliability at the Sn–9Zn–0.5Ag lead-free solder alloy–Cu interface by Ag precoating. Journal of Alloys and Compounds, 360. 217-224 doi:10.1016/s0925-8388(03)00300-1
Chang, Tao-Chih, Wang, Moo-Chin, Hon, Min-Hsiung (2004) Morphology and adhesion strength of the Sn–9Zn–3.5Ag/Cu interface after aging. Journal of Crystal Growth, 263 (1). 223-231 doi:10.1016/j.jcrysgro.2003.05.002
Chang, Tao-Chih, Wang, Moo-Chin, Hon, Min-Hsiung (2005) Thermal properties and interfacial reaction between the Sn-9Zn-xAg lead-free solders and Cu substrate. Metallurgical and Materials Transactions A, 36 (11). 3019-3029 doi:10.1007/s11661-005-0074-7
Chang, Tao-Chih, Wang, Moo-Chin, Hon, Min-Hsiung (2003) Effect of Ag addition on the structures of intermetallic compounds and the adhesion strength of the Sn–9Zn–xAg/Cu interface. Journal of Crystal Growth, 252 (1). 391-400 doi:10.1016/s0022-0248(02)02479-x
 
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