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Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2004) IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging. MATERIALS TRANSACTIONS, 45 (3). 727-733 doi:10.2320/matertrans.45.727

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Reference TypeJournal (article/letter/editorial)
TitleIMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
JournalMATERIALS TRANSACTIONS
AuthorsYoon, Jeong-WonAuthor
Kim, Sang-WonAuthor
Jung, Seung-BooAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.727Search in ResearchGate
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Mindat Ref. ID7777382Long-form Identifiermindat:1:5:7777382:9
GUID0
Full ReferenceYoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2004) IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging. MATERIALS TRANSACTIONS, 45 (3). 727-733 doi:10.2320/matertrans.45.727
Plain TextYoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2004) IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging. MATERIALS TRANSACTIONS, 45 (3). 727-733 doi:10.2320/matertrans.45.727
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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Yoon, Jeong Won, Kim, Sang Won, Jung, Seung Boo (2005) Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow. Materials Science Forum, 486. 289-292 doi:10.4028/www.scientific.net/msf.486-487.289
Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2004) Effect of reflow time on interfacial reaction and shear strength of Sn–0.7Cu solder/Cu and electroless Ni–P BGA joints. Journal of Alloys and Compounds, 385. 192-198 doi:10.1016/j.jallcom.2004.05.009
Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2005) IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate. Journal of Alloys and Compounds, 392. 247-252 doi:10.1016/j.jallcom.2004.09.045
Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2005) Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging. Journal of Alloys and Compounds, 391. 82-89 doi:10.1016/j.jallcom.2004.09.001
Yoon, Jeong Won, Lee, Chang Bae, Jung, Seung Boo (2004) Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging. Materials Science Forum, 449. 893-896 doi:10.4028/www.scientific.net/msf.449-452.893
Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2005) Interfacial Reaction and Mechanical Characterization of Eutectic Sn–Zn/ENIG Solder Joints during Reflow and Aging. MATERIALS TRANSACTIONS, 46 (11). 2386-2393 doi:10.2320/matertrans.46.2386
Yoon, Jeong-Won, Lee, Chang-Bae, Jung, Seung-Boo (2002) Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate. MATERIALS TRANSACTIONS, 43 (8). 1821-1826 doi:10.2320/matertrans.43.1821
Kim, Jong Woong, Yoon, Jeong Won, Jung, Seung Boo (2004) Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints. Materials Science Forum, 449. 897-900 doi:10.4028/www.scientific.net/msf.449-452.897
Lee, Sang-Min, Yoon, Jeong-Won, Jung, Seung-Boo (2016) Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes. MATERIALS TRANSACTIONS, 57 (3). 466-471 doi:10.2320/matertrans.m2015260
Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2006) Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Sn–Cu/Ni solder joint. Journal of Alloys and Compounds, 415. 56-61 doi:10.1016/j.jallcom.2005.03.124
Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2008) Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints. Materials Science and Engineering: A, 483. 731-734 doi:10.1016/j.msea.2006.09.162
 
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