Bae, Joon Woo, Lim, Jae-Won, Mimura, Kouji, Isshiki, Minoru (2004) Agglomeration of Copper Thin Film in Cu/Ta/Si Structure. MATERIALS TRANSACTIONS, 45 (3). 877-879 doi:10.2320/matertrans.45.877
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Agglomeration of Copper Thin Film in Cu/Ta/Si Structure | ||
Journal | MATERIALS TRANSACTIONS | ||
Authors | Bae, Joon Woo | Author | |
Lim, Jae-Won | Author | ||
Mimura, Kouji | Author | ||
Isshiki, Minoru | Author | ||
Year | 2004 | Volume | 45 |
Issue | 3 | ||
Publisher | Japan Institute of Metals | ||
DOI | doi:10.2320/matertrans.45.877Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 7777405 | Long-form Identifier | mindat:1:5:7777405:9 |
GUID | 0 | ||
Full Reference | Bae, Joon Woo, Lim, Jae-Won, Mimura, Kouji, Isshiki, Minoru (2004) Agglomeration of Copper Thin Film in Cu/Ta/Si Structure. MATERIALS TRANSACTIONS, 45 (3). 877-879 doi:10.2320/matertrans.45.877 | ||
Plain Text | Bae, Joon Woo, Lim, Jae-Won, Mimura, Kouji, Isshiki, Minoru (2004) Agglomeration of Copper Thin Film in Cu/Ta/Si Structure. MATERIALS TRANSACTIONS, 45 (3). 877-879 doi:10.2320/matertrans.45.877 | ||
In | (2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals |
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