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Yamaguchi, Atsushi, Yamashita, Yuhei, Furusawa, Akio, Nishida, Kazuto, Hojo, Takashi, Sogo, Yosuke, Miwa, Ayako, Hirose, Akio, Kobayashi, Kojiro F. (2004) Properties of Solder Joints Using Sn-Ag-Bi-In Solder. MATERIALS TRANSACTIONS, 45 (4). 1282-1289 doi:10.2320/matertrans.45.1282

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Reference TypeJournal (article/letter/editorial)
TitleProperties of Solder Joints Using Sn-Ag-Bi-In Solder
JournalMATERIALS TRANSACTIONS
AuthorsYamaguchi, AtsushiAuthor
Yamashita, YuheiAuthor
Furusawa, AkioAuthor
Nishida, KazutoAuthor
Hojo, TakashiAuthor
Sogo, YosukeAuthor
Miwa, AyakoAuthor
Hirose, AkioAuthor
Kobayashi, Kojiro F.Author
Year2004Volume45
Issue4
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.1282Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777470Long-form Identifiermindat:1:5:7777470:3
GUID0
Full ReferenceYamaguchi, Atsushi, Yamashita, Yuhei, Furusawa, Akio, Nishida, Kazuto, Hojo, Takashi, Sogo, Yosuke, Miwa, Ayako, Hirose, Akio, Kobayashi, Kojiro F. (2004) Properties of Solder Joints Using Sn-Ag-Bi-In Solder. MATERIALS TRANSACTIONS, 45 (4). 1282-1289 doi:10.2320/matertrans.45.1282
Plain TextYamaguchi, Atsushi, Yamashita, Yuhei, Furusawa, Akio, Nishida, Kazuto, Hojo, Takashi, Sogo, Yosuke, Miwa, Ayako, Hirose, Akio, Kobayashi, Kojiro F. (2004) Properties of Solder Joints Using Sn-Ag-Bi-In Solder. MATERIALS TRANSACTIONS, 45 (4). 1282-1289 doi:10.2320/matertrans.45.1282
In(2004) MATERIALS TRANSACTIONS Vol. 45 (4) Japan Institute of Metals

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Yamaguchi, Atsushi, Yamashita, Yuhei, Furusawa, Akio, Nishida, Kazuto, Hojo, Takashi, Sogo, Yosuke, Miwa, Ryoko, Hirose, Akio, Kobayashi, Kojiro F. (2005) Properties of Sn-Ag-Bi-In Solder Joints. Journal of the Japan Institute of Metals, 69 (1). 139-146 doi:10.2320/jinstmet.69.139
Sogo, Yousuke, Hojo, Takashi, Iwanishi, Hiroaki, Hirose, Akio, Kobayashi, Kojiro F., Yamaguch, Atsushi, Furusawa, Akio, Nishida, Kazuto (2004) Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating. MATERIALS TRANSACTIONS, 45 (3). 734-740 doi:10.2320/matertrans.45.734
Yamaguchi, Atsushi, Furusawa, Akio, Nishida, Kazuto, Iwanishi, Hiroaki, Hojo, Takashi, Sogo, Yosuke, Hirose, Akio, Kobayashi, Kojiro F. (2005) Interfacial Reaction Layer and Reliability of CSP Solder Joints using Sn-8Zn-3Bi Solder and Ni/Au Plating Pad. Journal of the Japan Institute of Metals, 69 (1). 132-138 doi:10.2320/jinstmet.69.132
Yamamoto, Takashi, Sakatani, Shigeaki, Kobayashi, Shinji, Uenishi, Keisuke, Kobayashi, Kojiro F., Ishio, Masaaki, Shiomi, Kazuhiro, Hashimoto, Akio, Yamamoto, Masaharu (2005) Reactivity between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases. MATERIALS TRANSACTIONS, 46 (11). 2406-2412 doi:10.2320/matertrans.46.2406
Hirose, Akio, Fujii, Toshio, Imamura, Takeshi, Kobayashi, Kojiro F. (2001) Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders. MATERIALS TRANSACTIONS, 42 (5). 794-802 doi:10.2320/matertrans.42.794
Hiramori, Tomoyuki, Ito, Mototaka, Tanii, Yoshiharu, Hirose, Akio, Kobayashi, Kojiro F. (2003) Sn-Ag Based Solders Bonded to Ni-P/Au Plating: Effects of Interfacial Structure on Joint Strength. MATERIALS TRANSACTIONS, 44 (11). 2375-2383 doi:10.2320/matertrans.44.2375
Ide, Eiichi, Hirose, Akio, Kobayashi, Kojiro F. (2006) Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging. MATERIALS TRANSACTIONS, 47 (1). 211-217 doi:10.2320/matertrans.47.211
Lee, Jaesik, Bang, Woongho, Jung, Jaepil, Oh, Kyuhwan (2004) Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass%Ag Solder Alloy. MATERIALS TRANSACTIONS, 45 (3). 783-789 doi:10.2320/matertrans.45.783
Suetsugu, Kenichiro, Furusawa, Akio, Tanaka, Masato, Takano, Hiroaki, Takehara, Hideki, Horiuchi, Toshihiro, Matsushige, Kazumi (2006) Liquidus Temperature Design of Lead-Free Solder. MATERIALS TRANSACTIONS, 47 (4). 1082-1089 doi:10.2320/matertrans.47.1082
Maeshima, Takashi, Nishida, Minoru (2004) Shape Memory Properties of Biomedical Ti-Mo-Ag and Ti-Mo-Sn Alloys. MATERIALS TRANSACTIONS, 45 (4). 1096-1100 doi:10.2320/matertrans.45.1096
Hirose, Akio, Abotani, Kazuhiro, Kobayashi, Kojiro F. (2001) In-Situ Formation of Nitride Particle Reinforced Titanium Aluminide by Reactive Plasma Arc Melting Process. MATERIALS TRANSACTIONS, 42 (2). 245-251 doi:10.2320/matertrans.42.245
 
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