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Hung, Fei-Yi, Chen, Puo-Sheng, Lui, Truan-Sheng, Chen, Li-Hui (2005) Thin Film Characteristics of Sn–3.5Ag–(2.0Cu) Alloy. MATERIALS TRANSACTIONS, 46 (12). 3020-3025 doi:10.2320/matertrans.46.3020

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Reference TypeJournal (article/letter/editorial)
TitleThin Film Characteristics of Sn–3.5Ag–(2.0Cu) Alloy
JournalMATERIALS TRANSACTIONS
AuthorsHung, Fei-YiAuthor
Chen, Puo-ShengAuthor
Lui, Truan-ShengAuthor
Chen, Li-HuiAuthor
Year2005Volume46
Issue12
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.46.3020Search in ResearchGate
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Mindat Ref. ID7777952Long-form Identifiermindat:1:5:7777952:2
GUID0
Full ReferenceHung, Fei-Yi, Chen, Puo-Sheng, Lui, Truan-Sheng, Chen, Li-Hui (2005) Thin Film Characteristics of Sn–3.5Ag–(2.0Cu) Alloy. MATERIALS TRANSACTIONS, 46 (12). 3020-3025 doi:10.2320/matertrans.46.3020
Plain TextHung, Fei-Yi, Chen, Puo-Sheng, Lui, Truan-Sheng, Chen, Li-Hui (2005) Thin Film Characteristics of Sn–3.5Ag–(2.0Cu) Alloy. MATERIALS TRANSACTIONS, 46 (12). 3020-3025 doi:10.2320/matertrans.46.3020
In(2005) MATERIALS TRANSACTIONS Vol. 46 (12) Japan Institute of Metals

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Hung, Fei-Yi, Lin, Hung-Mao, Chen, Puo-Sheng, Lui, Truan-Sheng, Chen, Li-Hui (2006) A study of the thin film on the surface of Sn–3.5Ag/Sn–3.5Ag–2.0Cu lead-free alloy. Journal of Alloys and Compounds, 415. 85-92 doi:10.1016/j.jallcom.2005.07.050
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Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, Chan, Cheng-Wei (2007) Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders. MATERIALS TRANSACTIONS, 48 (11). 3014-3020 doi:10.2320/matertrans.mer2007165
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