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Sueyoshi, Hidekazu, Fukudome, Hisayoshi (2008) Solid State Bonding of Carbon Material to Copper with Nickel Insert. MATERIALS TRANSACTIONS, 49 (9). 2063-2067 doi:10.2320/matertrans.h-mra2008819

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Reference TypeJournal (article/letter/editorial)
TitleSolid State Bonding of Carbon Material to Copper with Nickel Insert
JournalMATERIALS TRANSACTIONS
AuthorsSueyoshi, HidekazuAuthor
Fukudome, HisayoshiAuthor
Year2008Volume49
Issue9
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.h-mra2008819Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7779898Long-form Identifiermindat:1:5:7779898:9
GUID0
Full ReferenceSueyoshi, Hidekazu, Fukudome, Hisayoshi (2008) Solid State Bonding of Carbon Material to Copper with Nickel Insert. MATERIALS TRANSACTIONS, 49 (9). 2063-2067 doi:10.2320/matertrans.h-mra2008819
Plain TextSueyoshi, Hidekazu, Fukudome, Hisayoshi (2008) Solid State Bonding of Carbon Material to Copper with Nickel Insert. MATERIALS TRANSACTIONS, 49 (9). 2063-2067 doi:10.2320/matertrans.h-mra2008819
In(2008) MATERIALS TRANSACTIONS Vol. 49 (9) Japan Institute of Metals


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