Lee, Man-Seung, Ahn, Jong-Gwan, Ahn, Jae-Woo (2003) Recovery of copper, tin and lead from the spent nitric etching solutions of printed circuit board and regeneration of the etching solution. Hydrometallurgy, 70 (1). 23-29 doi:10.1016/s0304-386x(03)00045-8
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Recovery of copper, tin and lead from the spent nitric etching solutions of printed circuit board and regeneration of the etching solution | ||
Journal | Hydrometallurgy | ||
Authors | Lee, Man-Seung | Author | |
Ahn, Jong-Gwan | Author | ||
Ahn, Jae-Woo | Author | ||
Year | 2003 (July) | Volume | 70 |
Issue | 1 | ||
Publisher | Elsevier BV | ||
DOI | doi:10.1016/s0304-386x(03)00045-8Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 7888544 | Long-form Identifier | mindat:1:5:7888544:0 |
GUID | 0 | ||
Full Reference | Lee, Man-Seung, Ahn, Jong-Gwan, Ahn, Jae-Woo (2003) Recovery of copper, tin and lead from the spent nitric etching solutions of printed circuit board and regeneration of the etching solution. Hydrometallurgy, 70 (1). 23-29 doi:10.1016/s0304-386x(03)00045-8 | ||
Plain Text | Lee, Man-Seung, Ahn, Jong-Gwan, Ahn, Jae-Woo (2003) Recovery of copper, tin and lead from the spent nitric etching solutions of printed circuit board and regeneration of the etching solution. Hydrometallurgy, 70 (1). 23-29 doi:10.1016/s0304-386x(03)00045-8 | ||
In | (2003, July) Hydrometallurgy Vol. 70 (1) Elsevier BV |
See Also
These are possibly similar items as determined by title/reference text matching only.