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Oishi, T., Koyama, K., Alam, S., Tanaka, M., Lee, J.-C. (2007) Recovery of high purity copper cathode from printed circuit boards using ammoniacal sulfate or chloride solutions. Hydrometallurgy, 89 (1). 82-88 doi:10.1016/j.hydromet.2007.05.010

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Reference TypeJournal (article/letter/editorial)
TitleRecovery of high purity copper cathode from printed circuit boards using ammoniacal sulfate or chloride solutions
JournalHydrometallurgy
AuthorsOishi, T.Author
Koyama, K.Author
Alam, S.Author
Tanaka, M.Author
Lee, J.-C.Author
Year2007 (September)Volume89
Issue1
PublisherElsevier BV
DOIdoi:10.1016/j.hydromet.2007.05.010Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7889230Long-form Identifiermindat:1:5:7889230:7
GUID0
Full ReferenceOishi, T., Koyama, K., Alam, S., Tanaka, M., Lee, J.-C. (2007) Recovery of high purity copper cathode from printed circuit boards using ammoniacal sulfate or chloride solutions. Hydrometallurgy, 89 (1). 82-88 doi:10.1016/j.hydromet.2007.05.010
Plain TextOishi, T., Koyama, K., Alam, S., Tanaka, M., Lee, J.-C. (2007) Recovery of high purity copper cathode from printed circuit boards using ammoniacal sulfate or chloride solutions. Hydrometallurgy, 89 (1). 82-88 doi:10.1016/j.hydromet.2007.05.010
In(2007, September) Hydrometallurgy Vol. 89 (1) Elsevier BV

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Oishi, T., Yaguchi, M., Koyama, K., Tanaka, M., Lee, J.-c. (2013) Effect of additives on monovalent copper electrodeposition in ammoniacal alkaline solutions. Hydrometallurgy, 133. 58-63 doi:10.1016/j.hydromet.2012.11.015
Oishi, T., Yaguchi, M., Koyama, K., Tanaka, M., Lee, J.-C. (2008) Effect of phosphate on lead removal during a copper recycling process from wastes using ammoniacal chloride solution. Hydrometallurgy, 90 (2). 161-167 doi:10.1016/j.hydromet.2007.10.008
Alam, M.S., Tanaka, M., Koyama, K., Oishi, T., Lee, J.-C. (2007) Electrolyte purification in energy-saving monovalent copper electrowinning processes. Hydrometallurgy, 87 (1). 36-44 doi:10.1016/j.hydromet.2006.12.001
Sannigrahi, Sumana, Suthindhiran, K. (2019) Metal recovery from printed circuit boards by magnetotactic bacteria. Hydrometallurgy, 187. 113-124 doi:10.1016/j.hydromet.2019.05.007
Yang, Jian-guang, Wu, Yong-tian, Li, Jing (2012) Recovery of ultrafine copper particles from metal components of waste printed circuit boards. Hydrometallurgy, 121. 1-6 doi:10.1016/j.hydromet.2012.04.015
Oishi, Tetsuo, Koyama, Kazuya, Konishi, Hirokazu, Tanaka, Mikiya, Lee, Jae-Chun (2007) Influence of ammonium salt on electrowinning of copper from ammoniacal alkaline solutions. Electrochimica Acta, 53 (1). 127-132 doi:10.1016/j.electacta.2007.06.024
Da Silva, T.R., Majuste, D., Bauer, J., Moats, M.S. (2020) Effect of zinc ions on copper electrodeposition in the context of metal recovery from waste printed circuit boards. Hydrometallurgy, 198. 105513pp. doi:10.1016/j.hydromet.2020.105513
Sengupta, Bina, Bhakhar, Mathurkumar S., Sengupta, Ranjan (2007) Extraction of copper from ammoniacal solutions into emulsion liquid membranes using LIX 84 I®. Hydrometallurgy, 89 (3). 311-318 doi:10.1016/j.hydromet.2007.08.001
Li, Huan, Oraby, Elsayed, Eksteen, Jacques (2021) Recovery of copper and the deportment of other base metals from alkaline glycine leachates derived from waste printed circuit boards (WPCBs) Hydrometallurgy, 199. 105540pp. doi:10.1016/j.hydromet.2020.105540
Gámez, Sebastián, Garcés, Karla, de la Torre, Ernesto, Guevara, Alicia (2019) Precious metals recovery from waste printed circuit boards using thiosulfate leaching and ion exchange resin. Hydrometallurgy, 186. 1-11 doi:10.1016/j.hydromet.2019.03.004
Guimarães, Yuri F., Santos, Iranildes D., Dutra, Achilles J.B. (2014) Direct recovery of copper from printed circuit boards (PCBs) powder concentrate by a simultaneous electroleaching–electrodeposition process. Hydrometallurgy, 149. 63-70 doi:10.1016/j.hydromet.2014.06.005
 
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