Reference Type | Journal (article/letter/editorial) |
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Title | Effects of ionic liquid additive [BMIM]HSO4 on copper electro-deposition from acidic sulfate electrolyte |
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Journal | Hydrometallurgy |
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Authors | Zhang, Q.B. | Author |
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Hua, Y.X. | Author |
Wang, Y.T. | Author |
Lu, H.J. | Author |
Zhang, X.Y. | Author |
Year | 2009 (September) | Volume | 98 |
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Issue | 3 |
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Publisher | Elsevier BV |
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DOI | doi:10.1016/j.hydromet.2009.05.017Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 7889618 | Long-form Identifier | mindat:1:5:7889618:1 |
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GUID | 0 |
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Full Reference | Zhang, Q.B., Hua, Y.X., Wang, Y.T., Lu, H.J., Zhang, X.Y. (2009) Effects of ionic liquid additive [BMIM]HSO4 on copper electro-deposition from acidic sulfate electrolyte. Hydrometallurgy, 98 (3). 291-297 doi:10.1016/j.hydromet.2009.05.017 |
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Plain Text | Zhang, Q.B., Hua, Y.X., Wang, Y.T., Lu, H.J., Zhang, X.Y. (2009) Effects of ionic liquid additive [BMIM]HSO4 on copper electro-deposition from acidic sulfate electrolyte. Hydrometallurgy, 98 (3). 291-297 doi:10.1016/j.hydromet.2009.05.017 |
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In | (2009, September) Hydrometallurgy Vol. 98 (3) Elsevier BV |
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