Chang, Chin‐An (1987) Enhanced Cu‐Teflon adhesion by presputtering treatment: Effect of surface morphology changes. Applied Physics Letters, 51 (16). 1236-1238 doi:10.1063/1.98741
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Enhanced Cu‐Teflon adhesion by presputtering treatment: Effect of surface morphology changes | ||
Journal | Applied Physics Letters | ||
Authors | Chang, Chin‐An | Author | |
Year | 1987 (October 19) | Volume | 51 |
Issue | 16 | ||
Publisher | AIP Publishing | ||
DOI | doi:10.1063/1.98741Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 8481192 | Long-form Identifier | mindat:1:5:8481192:3 |
GUID | 0 | ||
Full Reference | Chang, Chin‐An (1987) Enhanced Cu‐Teflon adhesion by presputtering treatment: Effect of surface morphology changes. Applied Physics Letters, 51 (16). 1236-1238 doi:10.1063/1.98741 | ||
Plain Text | Chang, Chin‐An (1987) Enhanced Cu‐Teflon adhesion by presputtering treatment: Effect of surface morphology changes. Applied Physics Letters, 51 (16). 1236-1238 doi:10.1063/1.98741 | ||
In | (1987, October) Applied Physics Letters Vol. 51 (16) AIP Publishing |
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