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Liu, Ruibin, Harasiewicz, Kasia A., Knapik, D., Freeman, N. A., Stuart Foster, F. (1999) 2–2 piezoelectric composites with high density and fine scale fabricated by interdigital pair bonding. Applied Physics Letters, 75 (21). 3390-3392 doi:10.1063/1.125303

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Reference TypeJournal (article/letter/editorial)
Title2–2 piezoelectric composites with high density and fine scale fabricated by interdigital pair bonding
JournalApplied Physics Letters
AuthorsLiu, RuibinAuthor
Harasiewicz, Kasia A.Author
Knapik, D.Author
Freeman, N. A.Author
Stuart Foster, F.Author
Year1999 (November 22)Volume75
Issue21
PublisherAIP Publishing
DOIdoi:10.1063/1.125303Search in ResearchGate
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Mindat Ref. ID8525035Long-form Identifiermindat:1:5:8525035:0
GUID0
Full ReferenceLiu, Ruibin, Harasiewicz, Kasia A., Knapik, D., Freeman, N. A., Stuart Foster, F. (1999) 2–2 piezoelectric composites with high density and fine scale fabricated by interdigital pair bonding. Applied Physics Letters, 75 (21). 3390-3392 doi:10.1063/1.125303
Plain TextLiu, Ruibin, Harasiewicz, Kasia A., Knapik, D., Freeman, N. A., Stuart Foster, F. (1999) 2–2 piezoelectric composites with high density and fine scale fabricated by interdigital pair bonding. Applied Physics Letters, 75 (21). 3390-3392 doi:10.1063/1.125303
In(1999, November) Applied Physics Letters Vol. 75 (21) AIP Publishing

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