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Chou, C. H., Lin, C. L., Chuang, Y. C., Bor, H. Y., Liu, C. Y. (2007) High thermally stable Ni∕Ag(Al) alloy contacts on p-GaN. Applied Physics Letters, 90 (2). 22103pp. doi:10.1063/1.2431577

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Reference TypeJournal (article/letter/editorial)
TitleHigh thermally stable Ni∕Ag(Al) alloy contacts on p-GaN
JournalApplied Physics Letters
AuthorsChou, C. H.Author
Lin, C. L.Author
Chuang, Y. C.Author
Bor, H. Y.Author
Liu, C. Y.Author
Year2007 (January 8)Volume90
Issue2
PublisherAIP Publishing
DOIdoi:10.1063/1.2431577Search in ResearchGate
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Mindat Ref. ID8554103Long-form Identifiermindat:1:5:8554103:0
GUID0
Full ReferenceChou, C. H., Lin, C. L., Chuang, Y. C., Bor, H. Y., Liu, C. Y. (2007) High thermally stable Ni∕Ag(Al) alloy contacts on p-GaN. Applied Physics Letters, 90 (2). 22103pp. doi:10.1063/1.2431577
Plain TextChou, C. H., Lin, C. L., Chuang, Y. C., Bor, H. Y., Liu, C. Y. (2007) High thermally stable Ni∕Ag(Al) alloy contacts on p-GaN. Applied Physics Letters, 90 (2). 22103pp. doi:10.1063/1.2431577
In(2007, January) Applied Physics Letters Vol. 90 (2) AIP Publishing

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