Kim, Taek-Soo, Chumakov, Dmytro, Zschech, Ehrenfried, Dauskardt, Reinhold H. (2009) Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films. Applied Physics Letters, 95 (7). 71902pp. doi:10.1063/1.3190198
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films | ||
Journal | Applied Physics Letters | ||
Authors | Kim, Taek-Soo | Author | |
Chumakov, Dmytro | Author | ||
Zschech, Ehrenfried | Author | ||
Dauskardt, Reinhold H. | Author | ||
Year | 2009 (August 17) | Volume | 95 |
Issue | 7 | ||
Publisher | AIP Publishing | ||
DOI | doi:10.1063/1.3190198Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 8581085 | Long-form Identifier | mindat:1:5:8581085:1 |
GUID | 0 | ||
Full Reference | Kim, Taek-Soo, Chumakov, Dmytro, Zschech, Ehrenfried, Dauskardt, Reinhold H. (2009) Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films. Applied Physics Letters, 95 (7). 71902pp. doi:10.1063/1.3190198 | ||
Plain Text | Kim, Taek-Soo, Chumakov, Dmytro, Zschech, Ehrenfried, Dauskardt, Reinhold H. (2009) Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films. Applied Physics Letters, 95 (7). 71902pp. doi:10.1063/1.3190198 | ||
In | (2009, August) Applied Physics Letters Vol. 95 (7) AIP Publishing |
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