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Murray, Conal E., Besser, Paul R., Witt, Christian, Toney, Michael (2010) In situevolution of stress gradients in Cu films induced by capping layers. Applied Physics Letters, 96 (26). 261903pp. doi:10.1063/1.3458864

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Reference TypeJournal (article/letter/editorial)
TitleIn situevolution of stress gradients in Cu films induced by capping layers
JournalApplied Physics Letters
AuthorsMurray, Conal E.Author
Besser, Paul R.Author
Witt, ChristianAuthor
Toney, MichaelAuthor
Year2010 (June 28)Volume96
Issue26
PublisherAIP Publishing
DOIdoi:10.1063/1.3458864Search in ResearchGate
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Mindat Ref. ID8584774Long-form Identifiermindat:1:5:8584774:9
GUID0
Full ReferenceMurray, Conal E., Besser, Paul R., Witt, Christian, Toney, Michael (2010) In situevolution of stress gradients in Cu films induced by capping layers. Applied Physics Letters, 96 (26). 261903pp. doi:10.1063/1.3458864
Plain TextMurray, Conal E., Besser, Paul R., Witt, Christian, Toney, Michael (2010) In situevolution of stress gradients in Cu films induced by capping layers. Applied Physics Letters, 96 (26). 261903pp. doi:10.1063/1.3458864
In(2010, June) Applied Physics Letters Vol. 96 (26) AIP Publishing

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Murray, Conal E., Besser, Paul R., Witt, Christian, Jordan-Sweet, Jean L. (2008) Stress gradients induced in Cu films by capping layers. Applied Physics Letters, 93 (22). 221901pp. doi:10.1063/1.3035853
Murray, Conal E., Besser, Paul R., Witt, Christian, Jordan-Sweet, Jean L. (2010) Stress gradients observed in Cu thin films induced by capping layers. Journal of Materials Research, 25 (4) 622-628 doi:10.1557/jmr.2010.0102
Murray, Conal E., Priyadarshini, Deepika, Nguyen, Son, Ryan, E. Todd (2016) Tailoring capping layers to reduce stress gradients in copper metallization. Applied Physics Letters, 109 (23). 231907pp. doi:10.1063/1.4971395
Murray, Conal E., Besser, Paul R., Ryan, E. Todd, Jordan-Sweet, Jean L. (2011) Manipulating stress in Cu/low-k dielectric nanocomposites. Applied Physics Letters, 98 (14). 141916pp. doi:10.1063/1.3578192
Murray, Conal E., Besser, Paul R., Ryan, E. Todd, Jordan-Sweet, Jean L. (2011) Triaxial stress distributions in Cu/low-k interconnect features. Applied Physics Letters, 98 (6). 61908pp. doi:10.1063/1.3549876
Murray, Conal E., Jordan-Sweet, Jean, Todd Ryan, E., Toney, Michael F. (2012) Mitigating residual stress in Cu metallization. Applied Physics Letters, 101 (23). 231906pp. doi:10.1063/1.4769366
Murray, Conal E. (2014) Origin of stress gradients induced in capped, copper metallization. Applied Physics Letters, 104 (8). 81920pp. doi:10.1063/1.4867075
Murray, Conal E., Rosenberg, R., Witt, C., Treger, M., Noyan, I. C. (2013) Evolution of strain energy during recrystallization of plated Cu films. Journal of Applied Physics, 113 (20). 203515pp. doi:10.1063/1.4807409
Murray, Conal E., Zhang, Zhen, Lavoie, Christian (2009) Stress determination in nickel monosilicide films using x-ray diffraction. Journal of Applied Physics, 106 (7). 73521pp. doi:10.1063/1.3236626
Murray, Conal E., Zhang, Zhen, Lavoie, Christian (2011) Erratum: “Stress determination in nickel monosilicide films using x-ray diffraction” [J. Appl. Phys. 106, 073521 (2009)]. Journal of Applied Physics, 110 (9). 99903pp. doi:10.1063/1.3660347
Murray, Conal E., Goldsmith, Charles C., Shaw, Thomas M., Doyle, James P., Noyan, I. C. (2006) Thermal stress evolution in embedded Cu/low-k dielectric composite features. Applied Physics Letters, 89 (1). 11913pp. doi:10.1063/1.2219727
 
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