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Johnson, M. G., Selvakumar, J., Arockiasamy, S., Nagaraja, K. S. (2012) Nanocrystalline Cu–Ni Thin Film by Plasma-Assisted Liquid Injection Chemical Vapor Deposition. Advanced Science Letters, 10 (1). 29-33 doi:10.1166/asl.2012.2154

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Reference TypeJournal (article/letter/editorial)
TitleNanocrystalline Cu–Ni Thin Film by Plasma-Assisted Liquid Injection Chemical Vapor Deposition
JournalAdvanced Science Letters
AuthorsJohnson, M. G.Author
Selvakumar, J.Author
Arockiasamy, S.Author
Nagaraja, K. S.Author
Year2012 (May 15)Volume10
Issue1
PublisherAmerican Scientific Publishers
DOIdoi:10.1166/asl.2012.2154Search in ResearchGate
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Mindat Ref. ID9202593Long-form Identifiermindat:1:5:9202593:8
GUID0
Full ReferenceJohnson, M. G., Selvakumar, J., Arockiasamy, S., Nagaraja, K. S. (2012) Nanocrystalline Cu–Ni Thin Film by Plasma-Assisted Liquid Injection Chemical Vapor Deposition. Advanced Science Letters, 10 (1). 29-33 doi:10.1166/asl.2012.2154
Plain TextJohnson, M. G., Selvakumar, J., Arockiasamy, S., Nagaraja, K. S. (2012) Nanocrystalline Cu–Ni Thin Film by Plasma-Assisted Liquid Injection Chemical Vapor Deposition. Advanced Science Letters, 10 (1). 29-33 doi:10.1166/asl.2012.2154
In(2012, May) Advanced Science Letters Vol. 10 (1) American Scientific Publishers

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