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Han, Fengshan, Wu, Xinli, Cui, Zhongliang (2018) Numerical simulation of crack propagation in ceramic materials at high temperature. IOP Conference Series: Earth and Environmental Science, 189. 32022pp. doi:10.1088/1755-1315/189/3/032022

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Reference TypeJournal (article/letter/editorial)
TitleNumerical simulation of crack propagation in ceramic materials at high temperature
JournalIOP Conference Series: Earth and Environmental Science
AuthorsHan, FengshanAuthor
Wu, XinliAuthor
Cui, ZhongliangAuthor
Year2018 (November 6)Volume189
PublisherIOP Publishing
DOIdoi:10.1088/1755-1315/189/3/032022Search in ResearchGate
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Mindat Ref. ID9574002Long-form Identifiermindat:1:5:9574002:9
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Full ReferenceHan, Fengshan, Wu, Xinli, Cui, Zhongliang (2018) Numerical simulation of crack propagation in ceramic materials at high temperature. IOP Conference Series: Earth and Environmental Science, 189. 32022pp. doi:10.1088/1755-1315/189/3/032022
Plain TextHan, Fengshan, Wu, Xinli, Cui, Zhongliang (2018) Numerical simulation of crack propagation in ceramic materials at high temperature. IOP Conference Series: Earth and Environmental Science, 189. 32022pp. doi:10.1088/1755-1315/189/3/032022
In(2018) IOP Conference Series: Earth and Environmental Science Vol. 189. IOP Publishing

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