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Chung, S, Shrestha, S, Wen, X, Feng, Y, Gupta, N, Xia, H, Yu, P, Tang, J, Conibeer, G (2014) Evidence for a large phononic band gap leading to slow hot carrier thermalisation. IOP Conference Series: Materials Science and Engineering, 68. 12002pp. doi:10.1088/1757-899x/68/1/012002

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Reference TypeJournal (article/letter/editorial)
TitleEvidence for a large phononic band gap leading to slow hot carrier thermalisation
JournalIOP Conference Series: Materials Science and Engineering
AuthorsChung, SAuthor
Shrestha, SAuthor
Wen, XAuthor
Feng, YAuthor
Gupta, NAuthor
Xia, HAuthor
Yu, PAuthor
Tang, JAuthor
Conibeer, GAuthor
Year2014 (November 26)Volume68
PublisherIOP Publishing
DOIdoi:10.1088/1757-899x/68/1/012002Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID9777775Long-form Identifiermindat:1:5:9777775:3
GUID0
Full ReferenceChung, S, Shrestha, S, Wen, X, Feng, Y, Gupta, N, Xia, H, Yu, P, Tang, J, Conibeer, G (2014) Evidence for a large phononic band gap leading to slow hot carrier thermalisation. IOP Conference Series: Materials Science and Engineering, 68. 12002pp. doi:10.1088/1757-899x/68/1/012002
Plain TextChung, S, Shrestha, S, Wen, X, Feng, Y, Gupta, N, Xia, H, Yu, P, Tang, J, Conibeer, G (2014) Evidence for a large phononic band gap leading to slow hot carrier thermalisation. IOP Conference Series: Materials Science and Engineering, 68. 12002pp. doi:10.1088/1757-899x/68/1/012002
In(n.d.) IOP Conference Series: Materials Science and Engineering Vol. 68. IOP Publishing

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