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Jasiński, Piotr, Górecki, Krzysztof, Bogdanowicz, Robert (2016) Proceedings of the 39th International Microelectronics and Packaging IMAPS Poland Conference. IOP Conference Series: Materials Science and Engineering, 104. 11001pp. doi:10.1088/1757-899x/104/1/011001

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Reference TypeJournal (article/letter/editorial)
TitleProceedings of the 39th International Microelectronics and Packaging IMAPS Poland Conference
JournalIOP Conference Series: Materials Science and Engineering
AuthorsJasiński, PiotrAuthor
Górecki, KrzysztofAuthor
Bogdanowicz, RobertAuthor
Year2016 (January 21)Volume104
PublisherIOP Publishing
DOIdoi:10.1088/1757-899x/104/1/011001Search in ResearchGate
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Mindat Ref. ID9780144Long-form Identifiermindat:1:5:9780144:9
GUID0
Full ReferenceJasiński, Piotr, Górecki, Krzysztof, Bogdanowicz, Robert (2016) Proceedings of the 39th International Microelectronics and Packaging IMAPS Poland Conference. IOP Conference Series: Materials Science and Engineering, 104. 11001pp. doi:10.1088/1757-899x/104/1/011001
Plain TextJasiński, Piotr, Górecki, Krzysztof, Bogdanowicz, Robert (2016) Proceedings of the 39th International Microelectronics and Packaging IMAPS Poland Conference. IOP Conference Series: Materials Science and Engineering, 104. 11001pp. doi:10.1088/1757-899x/104/1/011001
In(n.d.) IOP Conference Series: Materials Science and Engineering Vol. 104. IOP Publishing

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