Efzan, M. N. Ervina, Ng, W.L., Abdullah, Mohd Mustafa Al Bakri (2016) Effect of Fluxes on 60Sn-40Bi Solder Alloy on Copper Substrate. IOP Conference Series: Materials Science and Engineering, 133. 12024pp. doi:10.1088/1757-899x/133/1/012024
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Effect of Fluxes on 60Sn-40Bi Solder Alloy on Copper Substrate | ||
Journal | IOP Conference Series: Materials Science and Engineering | ||
Authors | Efzan, M. N. Ervina | Author | |
Ng, W.L. | Author | ||
Abdullah, Mohd Mustafa Al Bakri | Author | ||
Year | 2016 (June) | Volume | 133 |
Publisher | IOP Publishing | ||
DOI | doi:10.1088/1757-899x/133/1/012024Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 9781778 | Long-form Identifier | mindat:1:5:9781778:7 |
GUID | 0 | ||
Full Reference | Efzan, M. N. Ervina, Ng, W.L., Abdullah, Mohd Mustafa Al Bakri (2016) Effect of Fluxes on 60Sn-40Bi Solder Alloy on Copper Substrate. IOP Conference Series: Materials Science and Engineering, 133. 12024pp. doi:10.1088/1757-899x/133/1/012024 | ||
Plain Text | Efzan, M. N. Ervina, Ng, W.L., Abdullah, Mohd Mustafa Al Bakri (2016) Effect of Fluxes on 60Sn-40Bi Solder Alloy on Copper Substrate. IOP Conference Series: Materials Science and Engineering, 133. 12024pp. doi:10.1088/1757-899x/133/1/012024 | ||
In | (n.d.) IOP Conference Series: Materials Science and Engineering Vol. 133. IOP Publishing |
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