Krishtab, M., de Marneffe, J.-F., Armini, S., Meersschaut, J., Bender, H., Wilson, C., De Gendt, S. (2019) Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues. Applied Surface Science, 485. 170-178 doi:10.1016/j.apsusc.2019.04.083
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues | ||
Journal | Applied Surface Science | ||
Authors | Krishtab, M. | Author | |
de Marneffe, J.-F. | Author | ||
Armini, S. | Author | ||
Meersschaut, J. | Author | ||
Bender, H. | Author | ||
Wilson, C. | Author | ||
De Gendt, S. | Author | ||
Year | 2019 (August) | Volume | 485 |
Publisher | Elsevier BV | ||
DOI | doi:10.1016/j.apsusc.2019.04.083Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 9938218 | Long-form Identifier | mindat:1:5:9938218:8 |
GUID | 0 | ||
Full Reference | Krishtab, M., de Marneffe, J.-F., Armini, S., Meersschaut, J., Bender, H., Wilson, C., De Gendt, S. (2019) Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues. Applied Surface Science, 485. 170-178 doi:10.1016/j.apsusc.2019.04.083 | ||
Plain Text | Krishtab, M., de Marneffe, J.-F., Armini, S., Meersschaut, J., Bender, H., Wilson, C., De Gendt, S. (2019) Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues. Applied Surface Science, 485. 170-178 doi:10.1016/j.apsusc.2019.04.083 | ||
In | (n.d.) Applied Surface Science Vol. 485. Elsevier BV |
See Also
These are possibly similar items as determined by title/reference text matching only.