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Cho, Chi Heon, Shin, Il Kwon, Kim, Kyu Young, Choi, Young Jin (2019) Enhancing adhesion properties between binder-free copper nanoink and flexible substrate using chemically generated interlocking structure. Applied Surface Science, 485. 484-489 doi:10.1016/j.apsusc.2019.04.234

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Reference TypeJournal (article/letter/editorial)
TitleEnhancing adhesion properties between binder-free copper nanoink and flexible substrate using chemically generated interlocking structure
JournalApplied Surface Science
AuthorsCho, Chi HeonAuthor
Shin, Il KwonAuthor
Kim, Kyu YoungAuthor
Choi, Young JinAuthor
Year2019 (August)Volume485
PublisherElsevier BV
DOIdoi:10.1016/j.apsusc.2019.04.234Search in ResearchGate
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Mindat Ref. ID9938265Long-form Identifiermindat:1:5:9938265:6
GUID0
Full ReferenceCho, Chi Heon, Shin, Il Kwon, Kim, Kyu Young, Choi, Young Jin (2019) Enhancing adhesion properties between binder-free copper nanoink and flexible substrate using chemically generated interlocking structure. Applied Surface Science, 485. 484-489 doi:10.1016/j.apsusc.2019.04.234
Plain TextCho, Chi Heon, Shin, Il Kwon, Kim, Kyu Young, Choi, Young Jin (2019) Enhancing adhesion properties between binder-free copper nanoink and flexible substrate using chemically generated interlocking structure. Applied Surface Science, 485. 484-489 doi:10.1016/j.apsusc.2019.04.234
In(n.d.) Applied Surface Science Vol. 485. Elsevier BV

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