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Yang, Cheng-Xiang, Li, Xin, Lu, Guo-Quan, Mei, Yun-Hui (2016) Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature. Materials Science and Engineering: A, 660. 71-76 doi:10.1016/j.msea.2016.02.082

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Reference TypeJournal (article/letter/editorial)
TitleEnhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature
JournalMaterials Science and Engineering: A
AuthorsYang, Cheng-XiangAuthor
Li, XinAuthor
Lu, Guo-QuanAuthor
Mei, Yun-HuiAuthor
Year2016 (April)Volume660
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2016.02.082Search in ResearchGate
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Mindat Ref. ID10048367Long-form Identifiermindat:1:5:10048367:7
GUID0
Full ReferenceYang, Cheng-Xiang, Li, Xin, Lu, Guo-Quan, Mei, Yun-Hui (2016) Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature. Materials Science and Engineering: A, 660. 71-76 doi:10.1016/j.msea.2016.02.082
Plain TextYang, Cheng-Xiang, Li, Xin, Lu, Guo-Quan, Mei, Yun-Hui (2016) Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature. Materials Science and Engineering: A, 660. 71-76 doi:10.1016/j.msea.2016.02.082
In(n.d.) Materials Science and Engineering: A Vol. 660. Elsevier BV

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Li, Xin, Chen, Gang, Wang, Lei, Mei, Yun-Hui, Chen, Xu, Lu, Guo-Quan (2013) Creep properties of low-temperature sintered nano-silver lap shear joints. Materials Science and Engineering: A, 579. 108-113 doi:10.1016/j.msea.2013.05.001
Fu, Shancan, Mei, Yunhui, Lu, Guo-Quan, Li, Xin, Chen, Gang, Chen, Xu (2014) Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging. Materials Letters, 128. 42-45 doi:10.1016/j.matlet.2014.04.127
Du, Cheng-Jie, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan (2019) An explanation of sintered silver bonding formation on bare copper substrate in air. Applied Surface Science, 490. 403-410 doi:10.1016/j.apsusc.2019.06.105
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Zhao, Peihao, Li, Xin, Mei, Yunhui, Lu, Guo-Quan (2022) High thermal conductivity diamond-doped silver paste for power electronics packaging. Materials Letters, 311. 131603pp. doi:10.1016/j.matlet.2021.131603
Wang, Bo, Yang, Jun, Guo, Rui, Gao, Jiqiang, Yang, Jianfeng (2009) Microstructure and boundary phases of Lu–Al-doped silicon nitride by pressureless sintering. Materials Science and Engineering: A, 500. 79-83 doi:10.1016/j.msea.2008.09.045
Wang, Tao, Chen, Gang, Wang, Yanping, Chen, Xu, Lu, Guo-quan (2010) Uniaxial ratcheting and fatigue behaviors of low-temperature sintered nano-scale silver paste at room and high temperatures. Materials Science and Engineering: A, 527. 6714-6722 doi:10.1016/j.msea.2010.07.012
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