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Wang, Meiyu, Mei, Yunhui, Li, Xin, Lu, Guo-Quan (2019) Die-attach on nickel substrate by pressureless sintering a trimodal silver paste. Materials Letters, 253. 131-135 doi:10.1016/j.matlet.2019.06.041

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Reference TypeJournal (article/letter/editorial)
TitleDie-attach on nickel substrate by pressureless sintering a trimodal silver paste
JournalMaterials Letters
AuthorsWang, MeiyuAuthor
Mei, YunhuiAuthor
Li, XinAuthor
Lu, Guo-QuanAuthor
Year2019 (October)Volume253
PublisherElsevier BV
DOIdoi:10.1016/j.matlet.2019.06.041Search in ResearchGate
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Mindat Ref. ID12431370Long-form Identifiermindat:1:5:12431370:7
GUID0
Full ReferenceWang, Meiyu, Mei, Yunhui, Li, Xin, Lu, Guo-Quan (2019) Die-attach on nickel substrate by pressureless sintering a trimodal silver paste. Materials Letters, 253. 131-135 doi:10.1016/j.matlet.2019.06.041
Plain TextWang, Meiyu, Mei, Yunhui, Li, Xin, Lu, Guo-Quan (2019) Die-attach on nickel substrate by pressureless sintering a trimodal silver paste. Materials Letters, 253. 131-135 doi:10.1016/j.matlet.2019.06.041
In(n.d.) Materials Letters Vol. 253. Elsevier BV

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