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KIM, J. H., SEOL, Y. G., LEE, N-E. (2007) Adhesion Properties of Electroless-Plated Cu Layers on Polyimide Treated by Inductively Coupled Plasmas. Journal of the Korean Physical Society, 51 (96). 187pp. doi:10.3938/jkps.51.187

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Reference TypeJournal (article/letter/editorial)
TitleAdhesion Properties of Electroless-Plated Cu Layers on Polyimide Treated by Inductively Coupled Plasmas
JournalJournal of the Korean Physical Society
AuthorsKIM, J. H.Author
SEOL, Y. G.Author
LEE, N-E.Author
Year2007 (December 31)Volume51
Issue96
PublisherKorean Physical Society
DOIdoi:10.3938/jkps.51.187Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID11232431Long-form Identifiermindat:1:5:11232431:9
GUID0
Full ReferenceKIM, J. H., SEOL, Y. G., LEE, N-E. (2007) Adhesion Properties of Electroless-Plated Cu Layers on Polyimide Treated by Inductively Coupled Plasmas. Journal of the Korean Physical Society, 51 (96). 187pp. doi:10.3938/jkps.51.187
Plain TextKIM, J. H., SEOL, Y. G., LEE, N-E. (2007) Adhesion Properties of Electroless-Plated Cu Layers on Polyimide Treated by Inductively Coupled Plasmas. Journal of the Korean Physical Society, 51 (96). 187pp. doi:10.3938/jkps.51.187
In(2007, December) Journal of the Korean Physical Society Vol. 51 (96) Korean Physical Society

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Kim, H. W., Kim, J. H., Kim, D. J., Lee, N.-E. (2009) Adhesion Enhancement of Electroless-Deposited Cu on Flexible Polyimide Substrate Treated by O[sub 2] and N[sub 2]/H[sub 2] Inductively Coupled Plasmas. Journal of the Electrochemical Society, 156. doi:10.1149/1.3231849
Kim, J. H., Kim, H. W., Park, S. M., Lee, N.-E. (2008) Selective Activation and Electroless Plating of Cu on a Polyimide Substrate by Using a Pre-Patterned Inhibitor Layer and Plasma Treatments. Journal of the Korean Physical Society, 52 (2). 318-323 doi:10.3938/jkps.52.318
Noh, Y. K., Hwang, Y. J., Kim, M. D., Kwon, Y. J., Oh, J. E., Kim, Y. H., Lee, J. Y. (2007) Strucrural Properties of GaSb Layers Grown on InAs, AlSb, and GaSb Buffer Layers on GaAs (001) Substrates. Journal of the Korean Physical Society, 50 (6). 1929pp. doi:10.3938/jkps.50.1929
Min, Kyoung-Jin, Park, Sung-Cheol, Park, Young-Bae, Lee, Kyu Hwan, Jeong, Yongsoo (2009) Effect of Post-Baking Treatment Conditions on the Interfacial Adhesion Energy between Electroless-Plated Ni and Polyimide Films. Journal of the Korean Physical Society, 54 (3). 1273-1277 doi:10.3938/jkps.54.1273
Nguyen, T. N. T., Lee, N.-E. (2007) Deep Reactive Ion Etching of Polyimide for Microfluidic Applications. Journal of the Korean Physical Society, 51 (3). 984pp. doi:10.3938/jkps.51.984
Kim, G. D., Woo, H. J., Hong, W., Kim, J. K., Choi, H. W., Lee, Y. O. (2007) Fast Neutron Facility of KIGAM. Journal of the Korean Physical Society, 51 (1). 24pp. doi:10.3938/jkps.51.24
Kwon, Deuk Chul, Yoon, N. S., Kim, J. H., Shin, Y. H., Chung, K. H. (2007) A Hybrid Solution of the Nonuniform Solenoidal-Type Inductively Coupled Plasma Heating Problem. Journal of the Korean Physical Society, 50 (1). 40-44 doi:10.3938/jkps.50.40
Jang, SungHo, Lee, MinHyong, Chung, ChinWook (2009) ?Langmuir probe perturbation in inductively coupled plasmas. Journal of the Korean Physical Society, 55 (5). 1869-1872 doi:10.3938/jkps.55.1869
Yang, J., Lee, Y. P. (2007) Structural and Magnetic Properties of Pr0.7Pb0.3MnO3. Journal of the Korean Physical Society, 51 (94). 1560pp. doi:10.3938/jkps.51.1560
LEE, Byoung H., SUNG, Myung M., KIM, Sang H., LEE, Ki-Dong (2007) Patterning Aluminum Thin Films by Water-Mediated Nano-Transfer Printing. Journal of the Korean Physical Society, 51 (96). 203pp. doi:10.3938/jkps.51.203
KIM, E.-K, LEE, H.-Y., PARK, J., PARK, S. J., KWAK, J. H., MOON, S. E., , S. MAENG, PARK, K.-H., KIM, S.-W., JI, H. J., KIM, G. T. (2007) Fabrication and Atmospheric-Pressure-Dependent Electrical Properties of a ZnO Nanowire Device. Journal of the Korean Physical Society, 51 (12). 170pp. doi:10.3938/jkps.51.170
 
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