Watch the Dallas Symposium LIVE, and fundraiser auction
Ticket proceeds support mindat.org! - click here...
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

Zhao, Jie, Qi, Lin, Wang, Xiu-min, Wang, Lai (2004) Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder. Journal of Alloys and Compounds, 375. 196-201 doi:10.1016/j.jallcom.2003.12.005

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleInfluence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder
JournalJournal of Alloys and Compounds
AuthorsZhao, JieAuthor
Qi, LinAuthor
Wang, Xiu-minAuthor
Wang, LaiAuthor
Year2004 (July)Volume375
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2003.12.005Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID11884502Long-form Identifiermindat:1:5:11884502:3
GUID0
Full ReferenceZhao, Jie, Qi, Lin, Wang, Xiu-min, Wang, Lai (2004) Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder. Journal of Alloys and Compounds, 375. 196-201 doi:10.1016/j.jallcom.2003.12.005
Plain TextZhao, Jie, Qi, Lin, Wang, Xiu-min, Wang, Lai (2004) Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder. Journal of Alloys and Compounds, 375. 196-201 doi:10.1016/j.jallcom.2003.12.005
In(n.d.) Journal of Alloys and Compounds Vol. 375. Elsevier BV

See Also

These are possibly similar items as determined by title/reference text matching only.

Yu, D.Q, Zhao, J, Wang, L (2004) Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements. Journal of Alloys and Compounds, 376. 170-175 doi:10.1016/j.jallcom.2004.01.012
Osório, Wislei R., Peixoto, Leandro C., Garcia, Leonardo R., Mangelinck-Noël, Nathalie, Garcia, Amauri (2013) Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys. Journal of Alloys and Compounds, 572. 97-106 doi:10.1016/j.jallcom.2013.03.234
Wang, Yuan, Zhao, Xiu Chen, Liu, Ying, Cheng, Jing Wei, Li, Hong, Xie, Xiao Chen (2015) Effect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder. Materials Science Forum, 815. 109-114 doi:10.4028/www.scientific.net/msf.815.109
Wang, Fengjiang, O’Keefe, Matthew, Brinkmeyer, Brandon (2009) Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys. Journal of Alloys and Compounds, 477. 267-273 doi:10.1016/j.jallcom.2008.10.141
Chang, Tao-Chih, Wang, Jian-Wen, Wang, Moo-Chin, Hon, Min-Hsiung (2006) Solderability of Sn–9Zn–0.5Ag–1In lead-free solder on Cu substrate. Journal of Alloys and Compounds, 422. 239-243 doi:10.1016/j.jallcom.2005.09.094
Chen, Guang, Wu, Fengshun, Liu, Changqing, Silberschmidt, Vadim V., Chan, Y.C. (2016) Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets. Journal of Alloys and Compounds, 656. 500-509 doi:10.1016/j.jallcom.2015.09.178
Wang, Jian-Xin, Xue, Song-Bai, Han, Zong-Jie, Yu, Sheng-Lin, Chen, Yan, Shi, Yi-Ping, Wang, Hui (2009) Effects of rare earth Ce on microstructures, solderability of Sn–Ag–Cu and Sn–Cu–Ni solders as well as mechanical properties of soldered joints. Journal of Alloys and Compounds, 467. 219-226 doi:10.1016/j.jallcom.2007.12.033
Chen, Jie, Shen, Jun, Lai, Shiqiang, Min, Dong, Wang, Xiaochuan (2010) Microstructural evolution of intermetallic compounds in Sn–3.5Ag–X (X=0, 0.75Ni, 1.0Zn and 1.5In)/Cu solder joints during liquid aging. Journal of Alloys and Compounds, 489. 631-637 doi:10.1016/j.jallcom.2009.09.135
Yu, D.Q., Wu, C.M.L., Law, C.M.T., Wang, L., Lai, J.K.L. (2005) Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method. Journal of Alloys and Compounds, 392. 192-199 doi:10.1016/j.jallcom.2004.09.023
Islam, M.N., Chan, Y.C., Rizvi, M.J., Jillek, W. (2005) Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder. Journal of Alloys and Compounds, 400. 136-144 doi:10.1016/j.jallcom.2005.03.053
Chen, Xu, Xue, Feng, Zhou, Jian, Yao, Yao (2015) Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder. Journal of Alloys and Compounds, 633. 377-383 doi:10.1016/j.jallcom.2015.01.219
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are © OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: August 21, 2025 03:00:46
Go to top of page