Watch the Dallas Symposium LIVE, and fundraiser auction
Ticket proceeds support mindat.org! - click here...
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

Wang, Fengjiang, O’Keefe, Matthew, Brinkmeyer, Brandon (2009) Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys. Journal of Alloys and Compounds, 477. 267-273 doi:10.1016/j.jallcom.2008.10.141

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleMicrostructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys
JournalJournal of Alloys and Compounds
AuthorsWang, FengjiangAuthor
O’Keefe, MatthewAuthor
Brinkmeyer, BrandonAuthor
Year2009 (May)Volume477
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2008.10.141Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID11892844Long-form Identifiermindat:1:5:11892844:3
GUID0
Full ReferenceWang, Fengjiang, O’Keefe, Matthew, Brinkmeyer, Brandon (2009) Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys. Journal of Alloys and Compounds, 477. 267-273 doi:10.1016/j.jallcom.2008.10.141
Plain TextWang, Fengjiang, O’Keefe, Matthew, Brinkmeyer, Brandon (2009) Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys. Journal of Alloys and Compounds, 477. 267-273 doi:10.1016/j.jallcom.2008.10.141
In(n.d.) Journal of Alloys and Compounds Vol. 477. Elsevier BV

See Also

These are possibly similar items as determined by title/reference text matching only.

El-Daly, A.A., Fawzy, A., Mohamad, A.Z., El-Taher, A.M. (2011) Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu. Journal of Alloys and Compounds, 509. 4574-4582 doi:10.1016/j.jallcom.2011.01.109
Islam, M.N., Chan, Y.C., Rizvi, M.J., Jillek, W. (2005) Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder. Journal of Alloys and Compounds, 400. 136-144 doi:10.1016/j.jallcom.2005.03.053
Shen, J., Chan, Y.C. (2009) Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn–Ag–Cu solder and a Cu layer. Journal of Alloys and Compounds, 477. 909-914 doi:10.1016/j.jallcom.2008.11.015
Lin, Kwang-Lung, Shih, Po-Cheng (2008) IMC formation on BGA package with Sn–Ag–Cu and Sn–Ag–Cu–Ni–Ge solder balls. Journal of Alloys and Compounds, 452. 291-297 doi:10.1016/j.jallcom.2006.11.036
Marques, V.M.F., Johnston, C., Grant, P.S. (2014) Microstructural evolution at Cu/Sn–Ag–Cu/Cu and Cu/Sn–Ag–Cu/Ni–Au ball grid array interfaces during thermal ageing. Journal of Alloys and Compounds, 613. 387-394 doi:10.1016/j.jallcom.2014.05.200
Zhao, Jie, Qi, Lin, Wang, Xiu-min, Wang, Lai (2004) Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder. Journal of Alloys and Compounds, 375. 196-201 doi:10.1016/j.jallcom.2003.12.005
Kumar, K. Mohan, Kripesh, V., Tay, Andrew A.O. (2008) Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn–Pb solder alloy. Journal of Alloys and Compounds, 455. 148-158 doi:10.1016/j.jallcom.2007.01.045
Wang, Fengjiang, Zhou, Lili, Wang, Xiaojing, He, Peng (2016) Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging. Journal of Alloys and Compounds, 688. 639-648 doi:10.1016/j.jallcom.2016.07.084
Yoon, Jeong-Won, Noh, Bo-In, Kim, Bong-Kyun, Shur, Chang-Chae, Jung, Seung-Boo (2009) Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints. Journal of Alloys and Compounds, 486. 142-147 doi:10.1016/j.jallcom.2009.06.159
El-Daly, A.A., El-Hosainy, H., Elmosalami, T.A., Desoky, W.M. (2015) Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying. Journal of Alloys and Compounds, 653. 402-410 doi:10.1016/j.jallcom.2015.09.033
Wang, Huigai, Zhang, Keke, Zhang, Meng (2019) Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder. Journal of Alloys and Compounds, 781. 761-772 doi:10.1016/j.jallcom.2018.12.080
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are © OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: August 19, 2025 15:06:45
Go to top of page