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El-Daly, A.A., Fawzy, A., Mohamad, A.Z., El-Taher, A.M. (2011) Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu. Journal of Alloys and Compounds, 509. 4574-4582 doi:10.1016/j.jallcom.2011.01.109

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Reference TypeJournal (article/letter/editorial)
TitleMicrostructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu
JournalJournal of Alloys and Compounds
AuthorsEl-Daly, A.A.Author
Fawzy, A.Author
Mohamad, A.Z.Author
El-Taher, A.M.Author
Year2011 (March)Volume509
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2011.01.109Search in ResearchGate
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Mindat Ref. ID11897795Long-form Identifiermindat:1:5:11897795:3
GUID0
Full ReferenceEl-Daly, A.A., Fawzy, A., Mohamad, A.Z., El-Taher, A.M. (2011) Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu. Journal of Alloys and Compounds, 509. 4574-4582 doi:10.1016/j.jallcom.2011.01.109
Plain TextEl-Daly, A.A., Fawzy, A., Mohamad, A.Z., El-Taher, A.M. (2011) Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu. Journal of Alloys and Compounds, 509. 4574-4582 doi:10.1016/j.jallcom.2011.01.109
In(n.d.) Journal of Alloys and Compounds Vol. 509. Elsevier BV

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El-Daly, A.A., Mohamad, A.Z., Fawzy, A., El-Taher, A.M. (2011) Creep behavior of near-peritectic Sn–5Sb solders containing small amount of Ag and Cu. Materials Science and Engineering: A, 528. 1055-1062 doi:10.1016/j.msea.2010.11.001
El-Daly, A.A., El-Tantawy, Farid, Hammad, A.E., Gaafar, M.S., El-Mossalamy, E.H., Al-Ghamdi, A.A. (2011) Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In. Journal of Alloys and Compounds, 509. 7238-7246 doi:10.1016/j.jallcom.2011.01.062
El-Daly, A.A., El-Hosainy, H., Elmosalami, T.A., Desoky, W.M. (2015) Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying. Journal of Alloys and Compounds, 653. 402-410 doi:10.1016/j.jallcom.2015.09.033
El-Daly, A.A., Hammad, A.E. (2011) Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In. Journal of Alloys and Compounds, 509. 8554-8560 doi:10.1016/j.jallcom.2011.05.119
El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.S., Ragab, M. (2014) Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn. Journal of Alloys and Compounds, 614. 20-28 doi:10.1016/j.jallcom.2014.06.009
El-Daly, A.A., El-Taher, A.M., Dalloul, T.R. (2014) Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder. Journal of Alloys and Compounds, 587. 32-39 doi:10.1016/j.jallcom.2013.10.148
El-Daly, A.A., El-Taher, A.M., Gouda, S. (2015) Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly. Journal of Alloys and Compounds, 627. 268-275 doi:10.1016/j.jallcom.2014.12.034
El-Daly, A.A., Eid, N.A.M., Ibrahiem, A.A. (2022) Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder. Journal of Alloys and Compounds, 902. 163808pp. doi:10.1016/j.jallcom.2022.163808
El-Daly, A.A., Swilem, Y., Makled, M.H., El-Shaarawy, M.G., Abdraboh, A.M. (2009) Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys. Journal of Alloys and Compounds, 484. 134-142 doi:10.1016/j.jallcom.2009.04.108
Wang, Fengjiang, O’Keefe, Matthew, Brinkmeyer, Brandon (2009) Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys. Journal of Alloys and Compounds, 477. 267-273 doi:10.1016/j.jallcom.2008.10.141
El-Daly, A.A., Hammad, A.E. (2010) Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys. Journal of Alloys and Compounds, 505. 793-800 doi:10.1016/j.jallcom.2010.06.142
 
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