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Shen, J., Chan, Y.C. (2009) Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn–Ag–Cu solder and a Cu layer. Journal of Alloys and Compounds, 477. 909-914 doi:10.1016/j.jallcom.2008.11.015

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Reference TypeJournal (article/letter/editorial)
TitleEffect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn–Ag–Cu solder and a Cu layer
JournalJournal of Alloys and Compounds
AuthorsShen, J.Author
Chan, Y.C.Author
Year2009 (May)Volume477
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2008.11.015Search in ResearchGate
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Mindat Ref. ID11892885Long-form Identifiermindat:1:5:11892885:6
GUID0
Full ReferenceShen, J., Chan, Y.C. (2009) Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn–Ag–Cu solder and a Cu layer. Journal of Alloys and Compounds, 477. 909-914 doi:10.1016/j.jallcom.2008.11.015
Plain TextShen, J., Chan, Y.C. (2009) Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn–Ag–Cu solder and a Cu layer. Journal of Alloys and Compounds, 477. 909-914 doi:10.1016/j.jallcom.2008.11.015
In(n.d.) Journal of Alloys and Compounds Vol. 477. Elsevier BV

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Shen, J., Chan, Y.C. (2009) Effects of ZrO2 nanoparticles on the mechanical properties of Sn–Zn solder joints on Au/Ni/Cu pads. Journal of Alloys and Compounds, 477. 552-559 doi:10.1016/j.jallcom.2008.10.140
Islam, M.N., Chan, Y.C., Rizvi, M.J., Jillek, W. (2005) Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder. Journal of Alloys and Compounds, 400. 136-144 doi:10.1016/j.jallcom.2005.03.053
Sharif, Ahmed, Chan, Y.C. (2005) Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization. Journal of Alloys and Compounds, 390. 67-73 doi:10.1016/j.jallcom.2004.08.023
Sharif, Ahmed, Chan, Y.C. (2005) Interfacial reactions on electrolytic Ni and electroless Ni(P) metallization with Sn–In–Ag–Cu solder. Journal of Alloys and Compounds, 393. 135-140 doi:10.1016/j.jallcom.2004.09.056
Chen, Yue-ting, Chan, Ya-ting, Chen, Chih-chi (2010) Wettability and interfacial reactions between the molten Sn–3.0wt%Ag–0.5wt%Cu solder (SAC305) and Ni–Co alloys. Journal of Alloys and Compounds, 507. 419-424 doi:10.1016/j.jallcom.2010.08.006
Yoon, Jeong-Won, Noh, Bo-In, Kim, Bong-Kyun, Shur, Chang-Chae, Jung, Seung-Boo (2009) Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints. Journal of Alloys and Compounds, 486. 142-147 doi:10.1016/j.jallcom.2009.06.159
Gain, Asit Kumar, Fouzder, Tama, Chan, Y.C., Yung, Winco K.C. (2011) Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads. Journal of Alloys and Compounds, 509. 3319-3325 doi:10.1016/j.jallcom.2010.12.048
Wang, Fengjiang, O’Keefe, Matthew, Brinkmeyer, Brandon (2009) Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys. Journal of Alloys and Compounds, 477. 267-273 doi:10.1016/j.jallcom.2008.10.141
Li, Qingqian, Chan, Y.C. (2013) Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures. Journal of Alloys and Compounds, 567. 47-53 doi:10.1016/j.jallcom.2013.03.093
Fouzder, Tama, Shafiq, Ismathullakhan, Chan, Y.C., Sharif, A., Yung, Winco K.C. (2011) Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads. Journal of Alloys and Compounds, 509. 1885-1892 doi:10.1016/j.jallcom.2010.10.081
Rizvi, M.J., Bailey, C., Chan, Y.C., Lu, H. (2007) Effect of adding 0.3wt% Ni into the Sn–0.7wt%Cu solder. Journal of Alloys and Compounds, 438. 116-121 doi:10.1016/j.jallcom.2006.08.048
 
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