Watch the Dallas Symposium LIVE, and fundraiser auction
Ticket proceeds support mindat.org! - click here...
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

Chen, Yue-ting, Chan, Ya-ting, Chen, Chih-chi (2010) Wettability and interfacial reactions between the molten Sn–3.0wt%Ag–0.5wt%Cu solder (SAC305) and Ni–Co alloys. Journal of Alloys and Compounds, 507. 419-424 doi:10.1016/j.jallcom.2010.08.006

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleWettability and interfacial reactions between the molten Sn–3.0wt%Ag–0.5wt%Cu solder (SAC305) and Ni–Co alloys
JournalJournal of Alloys and Compounds
AuthorsChen, Yue-tingAuthor
Chan, Ya-tingAuthor
Chen, Chih-chiAuthor
Year2010 (October)Volume507
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2010.08.006Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID11897311Long-form Identifiermindat:1:5:11897311:5
GUID0
Full ReferenceChen, Yue-ting, Chan, Ya-ting, Chen, Chih-chi (2010) Wettability and interfacial reactions between the molten Sn–3.0wt%Ag–0.5wt%Cu solder (SAC305) and Ni–Co alloys. Journal of Alloys and Compounds, 507. 419-424 doi:10.1016/j.jallcom.2010.08.006
Plain TextChen, Yue-ting, Chan, Ya-ting, Chen, Chih-chi (2010) Wettability and interfacial reactions between the molten Sn–3.0wt%Ag–0.5wt%Cu solder (SAC305) and Ni–Co alloys. Journal of Alloys and Compounds, 507. 419-424 doi:10.1016/j.jallcom.2010.08.006
In(n.d.) Journal of Alloys and Compounds Vol. 507. Elsevier BV

See Also

These are possibly similar items as determined by title/reference text matching only.

Chen, Chih-Chi, Chan, Ya-Ting, Chen, Yue-Ting (2010) Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C. Journal of Materials Research, 25 (7) 1321-1328 doi:10.1557/jmr.2010.0168
Chen, Chih-chi, Chen, Yue-ting (2012) Alternating reaction phases in Sn–Cu/Ni–Co solid-state reactions. Journal of Alloys and Compounds, 545. 28-31 doi:10.1016/j.jallcom.2012.08.052
Chen, Chih-chi, Chan, Ya-ting (2010) Sn/Ni–Co solid/solid interfacial reactions. Intermetallics, 18 (4). 649-654 doi:10.1016/j.intermet.2009.11.013
Lin, Chih-Fan, Hau, Nga Yu, Huang, Yu-Ting, Chang, Ya-Huei, Feng, Shien-Ping, Chen, Chih-Ming (2017) Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints. Journal of Alloys and Compounds, 708. 220-230 doi:10.1016/j.jallcom.2017.02.300
Sharif, Ahmed, Chan, Y.C. (2005) Interfacial reactions on electrolytic Ni and electroless Ni(P) metallization with Sn–In–Ag–Cu solder. Journal of Alloys and Compounds, 393. 135-140 doi:10.1016/j.jallcom.2004.09.056
Yoon, Jeong-Won, Noh, Bo-In, Kim, Bong-Kyun, Shur, Chang-Chae, Jung, Seung-Boo (2009) Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints. Journal of Alloys and Compounds, 486. 142-147 doi:10.1016/j.jallcom.2009.06.159
Xu, Hongyan, Yuan, Zhangfu, Matsuura, Hiroyuki, Tsukihashi, Fumitaka (2009) Hysteresis phenomenon and wetting characteristics of molten Sn–3.0wt.%Ag–0.5wt.%Cu on different tilting substrates. Journal of Alloys and Compounds, 487. 121-125 doi:10.1016/j.jallcom.2009.07.143
Chan, Hsing-Ting, Lin, Chih-Fan, Yen, Yee-Wen, Chen, Chih-Ming (2016) Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions. Journal of Alloys and Compounds, 668. 91-96 doi:10.1016/j.jallcom.2016.01.204
Lin, Chi-Pu, Chen, Chih-Ming, Lin, Ching-Hsuan, Su, Wen-Chiung (2010) Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate. Journal of Alloys and Compounds, 502. doi:10.1016/j.jallcom.2010.04.197
Islam, M.N., Chan, Y.C., Rizvi, M.J., Jillek, W. (2005) Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder. Journal of Alloys and Compounds, 400. 136-144 doi:10.1016/j.jallcom.2005.03.053
Shen, J., Chan, Y.C. (2009) Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn–Ag–Cu solder and a Cu layer. Journal of Alloys and Compounds, 477. 909-914 doi:10.1016/j.jallcom.2008.11.015
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are © OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: August 19, 2025 13:52:47
Go to top of page