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Chen, Chih-Chi, Chan, Ya-Ting, Chen, Yue-Ting (2010) Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C. Journal of Materials Research, 25 (7) 1321-1328 doi:10.1557/jmr.2010.0168

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C
JournalJournal of Materials Research
AuthorsChen, Chih-ChiAuthor
Chan, Ya-TingAuthor
Chen, Yue-TingAuthor
Year2010 (July)Volume25
Issue7
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1557/jmr.2010.0168Search in ResearchGate
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Mindat Ref. ID17103040Long-form Identifiermindat:1:5:17103040:4
GUID0
Full ReferenceChen, Chih-Chi, Chan, Ya-Ting, Chen, Yue-Ting (2010) Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C. Journal of Materials Research, 25 (7) 1321-1328 doi:10.1557/jmr.2010.0168
Plain TextChen, Chih-Chi, Chan, Ya-Ting, Chen, Yue-Ting (2010) Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C. Journal of Materials Research, 25 (7) 1321-1328 doi:10.1557/jmr.2010.0168
In(2010, July) Journal of Materials Research Vol. 25 (7) Springer Science and Business Media LLC

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Chen, Yue-ting, Chan, Ya-ting, Chen, Chih-chi (2010) Wettability and interfacial reactions between the molten Sn–3.0wt%Ag–0.5wt%Cu solder (SAC305) and Ni–Co alloys. Journal of Alloys and Compounds, 507. 419-424 doi:10.1016/j.jallcom.2010.08.006
Chen, Chih-chi, Chan, Ya-ting (2010) Sn/Ni–Co solid/solid interfacial reactions. Intermetallics, 18 (4). 649-654 doi:10.1016/j.intermet.2009.11.013
Chen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Solid/solid interfacial reactions between Sn–0.7 wt% Cu and Ni–7 wt% V. Journal of Materials Research, 23 (7) 1895-1901 doi:10.1557/jmr.2008.0235
Chen, Chih-chi, Chen, Yue-ting (2012) Alternating reaction phases in Sn–Cu/Ni–Co solid-state reactions. Journal of Alloys and Compounds, 545. 28-31 doi:10.1016/j.jallcom.2012.08.052
Chen, W. T., Ho, C. E., Kao, C. R. (2002) Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders. Journal of Materials Research, 17 (2) 263-266 doi:10.1557/jmr.2002.0036
Chen, Sinn-wen, Wang, Chao-hong (2006) Interfacial reactions of Sn-Cu/Ni couples at 250 °C. Journal of Materials Research, 21 (9) 2270-2277 doi:10.1557/jmr.2006.0298
Huang, Yu-chih, Chen, Sinn-wen (2010) Co alloying and size effects on solidification and interfacial reactions in the Sn–Zn–(Co)/Cu couples. Journal of Materials Research, 25 (12) 2430-2438 doi:10.1557/jmr.2010.0314
Lin, Shih-kang, Chen, Sinn-wen (2006) Interfacial reactions in the Sn–20 at.% In/Cu and Sn–20 at.% In/Ni couples at 160 °C. Journal of Materials Research, 21 (7) 1712-1717 doi:10.1557/jmr.2006.0200
Huang, Yu-chih, Chen, Sinn-wen, Gierlotka, Wojcieh, Chang, Chia-hua, Wu, Jen-chin (2007) Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders. Journal of Materials Research, 22 (10) 2924-2929 doi:10.1557/jmr.2007.0361
Lin, Shih-kang, Chung, Ting-ying, Chen, Sinn-wen, Chang, Chih-horng (2009) 250 °C isothermal section of ternary Sn-In-Cu phase equilibria. Journal of Materials Research, 24 (8) 2628-2637 doi:10.1557/jmr.2009.0317
Chen, Chih-ming, Chen, Sinn-wen (2003) Electromigration effects upon the low-temperature Sn/Ni interfacial reactions. Journal of Materials Research, 18 (6) 1293-1296 doi:10.1557/jmr.2003.0177
 
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