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Lin, Shih-kang, Chung, Ting-ying, Chen, Sinn-wen, Chang, Chih-horng (2009) 250 °C isothermal section of ternary Sn-In-Cu phase equilibria. Journal of Materials Research, 24 (8) 2628-2637 doi:10.1557/jmr.2009.0317

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Reference TypeJournal (article/letter/editorial)
Title250 °C isothermal section of ternary Sn-In-Cu phase equilibria
JournalJournal of Materials Research
AuthorsLin, Shih-kangAuthor
Chung, Ting-yingAuthor
Chen, Sinn-wenAuthor
Chang, Chih-horngAuthor
Year2009 (August)Volume24
Issue8
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1557/jmr.2009.0317Search in ResearchGate
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Mindat Ref. ID17103375Long-form Identifiermindat:1:5:17103375:7
GUID0
Full ReferenceLin, Shih-kang, Chung, Ting-ying, Chen, Sinn-wen, Chang, Chih-horng (2009) 250 °C isothermal section of ternary Sn-In-Cu phase equilibria. Journal of Materials Research, 24 (8) 2628-2637 doi:10.1557/jmr.2009.0317
Plain TextLin, Shih-kang, Chung, Ting-ying, Chen, Sinn-wen, Chang, Chih-horng (2009) 250 °C isothermal section of ternary Sn-In-Cu phase equilibria. Journal of Materials Research, 24 (8) 2628-2637 doi:10.1557/jmr.2009.0317
In(2009, August) Journal of Materials Research Vol. 24 (8) Springer Science and Business Media LLC

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Chen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Characterization of the ternary phase at the Sn/Ni–V joint. Journal of Materials Research, 23 (10) 2743-2748 doi:10.1557/jmr.2008.0338
Yen, Yee-wen, Chen, Sinn-wen (2004) Phase equilibria of the Ag–Sn–Cu ternary system. Journal of Materials Research, 19 (8) 2298-2305 doi:10.1557/jmr.2004.0296
Chen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Solid/solid interfacial reactions between Sn–0.7 wt% Cu and Ni–7 wt% V. Journal of Materials Research, 23 (7) 1895-1901 doi:10.1557/jmr.2008.0235
Gierlotka, Wojcieh, Chen, Sinn-wen, Lin, Shih-kang (2007) Thermodynamic description of the Cu–Sn system. Journal of Materials Research, 22 (11) 3158-3165 doi:10.1557/jmr.2007.0396
Lin, Shih-kang, Chen, Sinn-wen (2006) Interfacial reactions in the Sn–20 at.% In/Cu and Sn–20 at.% In/Ni couples at 160 °C. Journal of Materials Research, 21 (7) 1712-1717 doi:10.1557/jmr.2006.0200
Chen, Sinn-wen, Hsu, Hsiu-feng, Lin, Chih-wei (2004) Liquidus projection of the ternary Ag–Sn–Ni system. Journal of Materials Research, 19 (8) 2262-2267 doi:10.1557/jmr.2004.0295
Chen, Sinn-wen, Lin, Shih-kang (2006) Electric current-induced abnormal Cu/γ-InSn4 interfacial reactions. Journal of Materials Research, 21 (12) 3065-3071 doi:10.1557/jmr.2006.0378
Chen, Sinn-wen, Wang, Chao-hong (2006) Interfacial reactions of Sn-Cu/Ni couples at 250 °C. Journal of Materials Research, 21 (9) 2270-2277 doi:10.1557/jmr.2006.0298
Huang, Yu-chih, Chen, Sinn-wen, Gierlotka, Wojcieh, Chang, Chia-hua, Wu, Jen-chin (2007) Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders. Journal of Materials Research, 22 (10) 2924-2929 doi:10.1557/jmr.2007.0361
Chen, Sinn-wen, Hsu, Che-wei, Lin, Shih-kang, Hsu, Chia-ming (2013) Reaction evolution in Sn–20.0 wt% In–2.8 wt% Ag/Ni couples. Journal of Materials Research, 28 (23) 3257-3260 doi:10.1557/jmr.2013.308
Chen, Chih-Chi, Chan, Ya-Ting, Chen, Yue-Ting (2010) Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C. Journal of Materials Research, 25 (7) 1321-1328 doi:10.1557/jmr.2010.0168
 
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