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Chen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Characterization of the ternary phase at the Sn/Ni–V joint. Journal of Materials Research, 23 (10) 2743-2748 doi:10.1557/jmr.2008.0338

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Reference TypeJournal (article/letter/editorial)
TitleCharacterization of the ternary phase at the Sn/Ni–V joint
JournalJournal of Materials Research
AuthorsChen, Chih-chiAuthor
Chen, Sinn-wenAuthor
Chang, Chih-horngAuthor
Year2008 (October)Volume23
Issue10
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1557/jmr.2008.0338Search in ResearchGate
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Mindat Ref. ID17103775Long-form Identifiermindat:1:5:17103775:5
GUID0
Full ReferenceChen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Characterization of the ternary phase at the Sn/Ni–V joint. Journal of Materials Research, 23 (10) 2743-2748 doi:10.1557/jmr.2008.0338
Plain TextChen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Characterization of the ternary phase at the Sn/Ni–V joint. Journal of Materials Research, 23 (10) 2743-2748 doi:10.1557/jmr.2008.0338
In(2008, October) Journal of Materials Research Vol. 23 (10) Springer Science and Business Media LLC

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Chen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Solid/solid interfacial reactions between Sn–0.7 wt% Cu and Ni–7 wt% V. Journal of Materials Research, 23 (7) 1895-1901 doi:10.1557/jmr.2008.0235
Chen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Electromigration effects upon the Sn∕Ni–7wt%V interfacial reactions. Journal of Applied Physics, 103 (6). 63518pp. doi:10.1063/1.2899956
Lin, Shih-kang, Chung, Ting-ying, Chen, Sinn-wen, Chang, Chih-horng (2009) 250 °C isothermal section of ternary Sn-In-Cu phase equilibria. Journal of Materials Research, 24 (8) 2628-2637 doi:10.1557/jmr.2009.0317
Chen, Sinn-wen, Hsu, Hsiu-feng, Lin, Chih-wei (2004) Liquidus projection of the ternary Ag–Sn–Ni system. Journal of Materials Research, 19 (8) 2262-2267 doi:10.1557/jmr.2004.0295
Chen, Chih-ming, Chen, Sinn-wen (2003) Electromigration effects upon the low-temperature Sn/Ni interfacial reactions. Journal of Materials Research, 18 (6) 1293-1296 doi:10.1557/jmr.2003.0177
Chao, Yi-Hsiang, Chen, Sinn-Wen, Chang, Chih-Hong, Chen, Chih-Chi (2008) Phase Equilibria of Sn-Co-Ni System and Interfacial Reactions in Sn/(Co, Ni) Couples. Metallurgical and Materials Transactions A, 39 (3). 477-489 doi:10.1007/s11661-007-9429-6
Huang, Yu-chih, Chen, Sinn-wen, Gierlotka, Wojcieh, Chang, Chia-hua, Wu, Jen-chin (2007) Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders. Journal of Materials Research, 22 (10) 2924-2929 doi:10.1557/jmr.2007.0361
Yen, Yee-wen, Chen, Sinn-wen (2004) Phase equilibria of the Ag–Sn–Cu ternary system. Journal of Materials Research, 19 (8) 2298-2305 doi:10.1557/jmr.2004.0296
Chen, Chih-Chi, Chan, Ya-Ting, Chen, Yue-Ting (2010) Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C. Journal of Materials Research, 25 (7) 1321-1328 doi:10.1557/jmr.2010.0168
Chen, Yu-Kai, Hsu, Chia-Ming, Chen, Sinn-Wen, Chen, Chih-Ming, Huang, Yu-Chih (2012) Phase Equilibria of Sn-Co-Cu Ternary System. Metallurgical and Materials Transactions A, 43 (10). 3586-3595 doi:10.1007/s11661-012-1192-7
Huang, Yu-chih, Chen, Sinn-wen (2010) Co alloying and size effects on solidification and interfacial reactions in the Sn–Zn–(Co)/Cu couples. Journal of Materials Research, 25 (12) 2430-2438 doi:10.1557/jmr.2010.0314
 
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