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Chen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Electromigration effects upon the Sn∕Ni–7wt%V interfacial reactions. Journal of Applied Physics, 103 (6). 63518pp. doi:10.1063/1.2899956

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Reference TypeJournal (article/letter/editorial)
TitleElectromigration effects upon the Sn∕Ni–7wt%V interfacial reactions
JournalJournal of Applied Physics
AuthorsChen, Chih-chiAuthor
Chen, Sinn-wenAuthor
Chang, Chih-horngAuthor
Year2008 (March 15)Volume103
Issue6
PublisherAIP Publishing
DOIdoi:10.1063/1.2899956Search in ResearchGate
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Mindat Ref. ID5154772Long-form Identifiermindat:1:5:5154772:9
GUID0
Full ReferenceChen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Electromigration effects upon the Sn∕Ni–7wt%V interfacial reactions. Journal of Applied Physics, 103 (6). 63518pp. doi:10.1063/1.2899956
Plain TextChen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Electromigration effects upon the Sn∕Ni–7wt%V interfacial reactions. Journal of Applied Physics, 103 (6). 63518pp. doi:10.1063/1.2899956
In(2008, March) Journal of Applied Physics Vol. 103 (6) AIP Publishing

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Chen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Solid/solid interfacial reactions between Sn–0.7 wt% Cu and Ni–7 wt% V. Journal of Materials Research, 23 (7) 1895-1901 doi:10.1557/jmr.2008.0235
Chen, Chih-ming, Chen, Sinn-wen (2003) Electromigration effects upon the low-temperature Sn/Ni interfacial reactions. Journal of Materials Research, 18 (6) 1293-1296 doi:10.1557/jmr.2003.0177
Chen, Chih-ming, Chen, Sinn-wen (2001) Electromigration effect upon the Sn–0.7 wt% Cu/Ni and Sn–3.5 wt% Ag/Ni interfacial reactions. Journal of Applied Physics, 90 (3). 1208-1214 doi:10.1063/1.1380219
Chen, Chih-chi, Chen, Sinn-wen, Chang, Chih-horng (2008) Characterization of the ternary phase at the Sn/Ni–V joint. Journal of Materials Research, 23 (10) 2743-2748 doi:10.1557/jmr.2008.0338
Chao, Yi-Hsiang, Chen, Sinn-Wen, Chang, Chih-Hong, Chen, Chih-Chi (2008) Phase Equilibria of Sn-Co-Ni System and Interfacial Reactions in Sn/(Co, Ni) Couples. Metallurgical and Materials Transactions A, 39 (3). 477-489 doi:10.1007/s11661-007-9429-6
Du, Mei-yau, Chen, Chih-ming, Chen, Sinn-wen (2003) Effects upon interfacial reactions by electric currents of reversing directions. Materials Chemistry and Physics, 82. 818-825 doi:10.1016/j.matchemphys.2003.07.013
Huang, Yu-Chih, Gierlotka, Wojciech, Chen, Sinn-Wen (2010) Sn–Bi–Fe thermodynamic modeling and Sn–Bi/Fe interfacial reactions. Intermetallics, 18 (5). 984-991 doi:10.1016/j.intermet.2010.01.026
Huang, Yu-chih, Chen, Sinn-wen, Gierlotka, Wojcieh, Chang, Chia-hua, Wu, Jen-chin (2007) Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders. Journal of Materials Research, 22 (10) 2924-2929 doi:10.1557/jmr.2007.0361
Huang, Yu-chih, Chen, Sinn-wen (2010) Co alloying and size effects on solidification and interfacial reactions in the Sn–Zn–(Co)/Cu couples. Journal of Materials Research, 25 (12) 2430-2438 doi:10.1557/jmr.2010.0314
Chen, Chih-chi, Chan, Ya-ting (2010) Sn/Ni–Co solid/solid interfacial reactions. Intermetallics, 18 (4). 649-654 doi:10.1016/j.intermet.2009.11.013
Lin, Chi-Pu, Chen, Chih-Ming, Yen, Yee-Wen, Wu, Hsin-Jay, Chen, Sinn-Wen (2011) Interfacial reactions between high-Pb solders and Ag. Journal of Alloys and Compounds, 509. 3509-3514 doi:10.1016/j.jallcom.2010.12.135
 
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