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Chan, Hsing-Ting, Lin, Chih-Fan, Yen, Yee-Wen, Chen, Chih-Ming (2016) Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions. Journal of Alloys and Compounds, 668. 91-96 doi:10.1016/j.jallcom.2016.01.204

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Reference TypeJournal (article/letter/editorial)
TitleEffects of current stressing on the p-Bi2Te3/Sn interfacial reactions
JournalJournal of Alloys and Compounds
AuthorsChan, Hsing-TingAuthor
Lin, Chih-FanAuthor
Yen, Yee-WenAuthor
Chen, Chih-MingAuthor
Year2016 (May)Volume668
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2016.01.204Search in ResearchGate
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Mindat Ref. ID11911700Long-form Identifiermindat:1:5:11911700:6
GUID0
Full ReferenceChan, Hsing-Ting, Lin, Chih-Fan, Yen, Yee-Wen, Chen, Chih-Ming (2016) Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions. Journal of Alloys and Compounds, 668. 91-96 doi:10.1016/j.jallcom.2016.01.204
Plain TextChan, Hsing-Ting, Lin, Chih-Fan, Yen, Yee-Wen, Chen, Chih-Ming (2016) Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions. Journal of Alloys and Compounds, 668. 91-96 doi:10.1016/j.jallcom.2016.01.204
In(n.d.) Journal of Alloys and Compounds Vol. 668. Elsevier BV

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Lin, Chih-Fan, Hau, Nga Yu, Huang, Yu-Ting, Chang, Ya-Huei, Feng, Shien-Ping, Chen, Chih-Ming (2017) Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints. Journal of Alloys and Compounds, 708. 220-230 doi:10.1016/j.jallcom.2017.02.300
Chen, Sinn-wen, Wu, Chih-yu, Wu, Hsin-jay, Chiu, Wan-ting (2014) Interfacial reactions in Sn/Bi2Te3, Sn/Bi2Se3 and Sn/Bi2(Te1−xSex)3 couples. Journal of Alloys and Compounds, 611. 313-318 doi:10.1016/j.jallcom.2014.05.127
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Chen, Yue-ting, Chan, Ya-ting, Chen, Chih-chi (2010) Wettability and interfacial reactions between the molten Sn–3.0wt%Ag–0.5wt%Cu solder (SAC305) and Ni–Co alloys. Journal of Alloys and Compounds, 507. 419-424 doi:10.1016/j.jallcom.2010.08.006
Yen, Yee-Wen, Lin, Chung-Yung, Hermana, Gita Novian, Chen, Pei-Yu, Wu, Yi-Pin (2017) Interfacial reactions in the Au/Sn-xZn/Cu sandwich couples. Journal of Alloys and Compounds, 710. 479-490 doi:10.1016/j.jallcom.2017.03.285
Lin, Chih-Fan, Lee, Shang-Hua, Chen, Chih-Ming (2012) Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current Stressing. Metallurgical and Materials Transactions A, 43 (8). 2571-2573 doi:10.1007/s11661-012-1276-4
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