Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan (2006) High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization. Journal of Alloys and Compounds, 425. 191-199 doi:10.1016/j.jallcom.2006.01.080
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization | ||
| Journal | Journal of Alloys and Compounds | ||
| Authors | Sun, Peng | Author | |
| Andersson, Cristina | Author | ||
| Wei, Xicheng | Author | ||
| Cheng, Zhaonian | Author | ||
| Shangguan, Dongkai | Author | ||
| Liu, Johan | Author | ||
| Year | 2006 (November) | Volume | 425 |
| Publisher | Elsevier BV | ||
| DOI | doi:10.1016/j.jallcom.2006.01.080Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 11887621 | Long-form Identifier | mindat:1:5:11887621:8 |
| GUID | 0 | ||
| Full Reference | Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan (2006) High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization. Journal of Alloys and Compounds, 425. 191-199 doi:10.1016/j.jallcom.2006.01.080 | ||
| Plain Text | Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan (2006) High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization. Journal of Alloys and Compounds, 425. 191-199 doi:10.1016/j.jallcom.2006.01.080 | ||
| In | (n.d.) Journal of Alloys and Compounds Vol. 425. Elsevier BV | ||
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