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Yen, Yee-Wen, Chiang, Yu-Cheng, Jao, Chien-Chung, Liaw, Da-Wei, Lo, Shao-cheng, Lee, Chiapyng (2011) Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate. Journal of Alloys and Compounds, 509. 4595-4602 doi:10.1016/j.jallcom.2011.01.114

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate
JournalJournal of Alloys and Compounds
AuthorsYen, Yee-WenAuthor
Chiang, Yu-ChengAuthor
Jao, Chien-ChungAuthor
Liaw, Da-WeiAuthor
Lo, Shao-chengAuthor
Lee, ChiapyngAuthor
Year2011 (March)Volume509
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2011.01.114Search in ResearchGate
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Mindat Ref. ID11897799Long-form Identifiermindat:1:5:11897799:1
GUID0
Full ReferenceYen, Yee-Wen, Chiang, Yu-Cheng, Jao, Chien-Chung, Liaw, Da-Wei, Lo, Shao-cheng, Lee, Chiapyng (2011) Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate. Journal of Alloys and Compounds, 509. 4595-4602 doi:10.1016/j.jallcom.2011.01.114
Plain TextYen, Yee-Wen, Chiang, Yu-Cheng, Jao, Chien-Chung, Liaw, Da-Wei, Lo, Shao-cheng, Lee, Chiapyng (2011) Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate. Journal of Alloys and Compounds, 509. 4595-4602 doi:10.1016/j.jallcom.2011.01.114
In(n.d.) Journal of Alloys and Compounds Vol. 509. Elsevier BV

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Yen, Yee-wen, Tsai, Po-hao, Fang, Yang-kai, Lo, Shao-cheng, Hsieh, Yu-Ping, Lee, Chiapyng (2010) Interfacial reactions on Pb-free solders with Au/Pd/Ni/Cu multilayer substrates. Journal of Alloys and Compounds, 503. 25-30 doi:10.1016/j.jallcom.2010.04.241
Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan (2006) High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization. Journal of Alloys and Compounds, 425. 191-199 doi:10.1016/j.jallcom.2006.01.080
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Yen, Yee-Wen, Jao, Chien-Chung, Lee, Chiapyng (2006) Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag. Journal of Materials Research, 21 (12) 2986-2990 doi:10.1557/jmr.2006.0369
Jao, Chien-Chung, Yen, Yee-Wen, Lin, Chung-Yung, Lee, Chiapyng (2008) Phase equilibria of the Sn–Zn–Ag system and interfacial reactions in Sn–Zn/Ag couples. Intermetallics, 16 (3). 463-469 doi:10.1016/j.intermet.2007.12.007
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