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Zhang, X.F., Guo, J.D., Shang, J.K. (2009) Growth kinetics of intermetallic compounds between Sn–9Zn solder and electroplated Fe–42Ni metallization. Journal of Alloys and Compounds, 487. 776-780 doi:10.1016/j.jallcom.2009.08.064

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Reference TypeJournal (article/letter/editorial)
TitleGrowth kinetics of intermetallic compounds between Sn–9Zn solder and electroplated Fe–42Ni metallization
JournalJournal of Alloys and Compounds
AuthorsZhang, X.F.Author
Guo, J.D.Author
Shang, J.K.Author
Year2009 (November)Volume487
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2009.08.064Search in ResearchGate
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Mindat Ref. ID11894693Long-form Identifiermindat:1:5:11894693:5
GUID0
Full ReferenceZhang, X.F., Guo, J.D., Shang, J.K. (2009) Growth kinetics of intermetallic compounds between Sn–9Zn solder and electroplated Fe–42Ni metallization. Journal of Alloys and Compounds, 487. 776-780 doi:10.1016/j.jallcom.2009.08.064
Plain TextZhang, X.F., Guo, J.D., Shang, J.K. (2009) Growth kinetics of intermetallic compounds between Sn–9Zn solder and electroplated Fe–42Ni metallization. Journal of Alloys and Compounds, 487. 776-780 doi:10.1016/j.jallcom.2009.08.064
In(n.d.) Journal of Alloys and Compounds Vol. 487. Elsevier BV

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Zhang, X.F., Guo, J.D., Shang, J.K. (2009) Controlling intermetallic compound formation reaction between Sn and Ni–P by Zn addition. Journal of Alloys and Compounds, 479. 505-510 doi:10.1016/j.jallcom.2008.12.093
Schmetterer, Clemens, Flandorfer, Hans, Ipser, Herbert (2009) Comment on the paper “Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition” by X.F. Zhang, J.D. Guo, J.K. Shang, J. Alloys Compd. 479 (2009) 505–510. Journal of Alloys and Compounds, 486. doi:10.1016/j.jallcom.2009.06.152
Yao, Yao, Zhou, Jian, Xue, Feng, Chen, Xu (2016) Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process. Journal of Alloys and Compounds, 682. 627-633 doi:10.1016/j.jallcom.2016.04.263
Li, Z.H., Tang, Y., Guo, Q.W., Li, G.Y. (2020) A diffusion model and growth kinetics of interfacial intermetallic compounds in Sn-0.3Ag-0.7Cu and Sn-0.3Ag-0.7Cu-0.5CeO2 solder joints. Journal of Alloys and Compounds, 818. 152893pp. doi:10.1016/j.jallcom.2019.152893
Ye, Huan, Xue, Songbai, Zhang, Liang, Xiao, Zhengxiang, Hu, Yuhua, Lai, Zhongmin, Zhu, Hong (2011) Sn whisker growth in Sn–9Zn–0.5Ga–0.7Pr lead-free solder. Journal of Alloys and Compounds, 509. doi:10.1016/j.jallcom.2010.09.189
Yu, D.Q., Wu, C.M.L., Law, C.M.T., Wang, L., Lai, J.K.L. (2005) Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method. Journal of Alloys and Compounds, 392. 192-199 doi:10.1016/j.jallcom.2004.09.023
Chang, Tao-Chih, Wang, Moo-Chin, Hon, Min-Hsiung (2005) Growth and morphology of the intermetallic compounds formed at the Sn–9Zn–2.5Ag/Cu interface. Journal of Alloys and Compounds, 402. 141-148 doi:10.1016/j.jallcom.2005.04.141
Zhang, X.F., Guo, J.D., Shang, J.K. (2008) Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn–Zn solder interconnect. Journal of Materials Research, 23 (12) 3370-3378 doi:10.1557/jmr.2008.0413
Ren, Guang, Collins, Maurice N. (2019) On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates. Journal of Alloys and Compounds, 791. 559-566 doi:10.1016/j.jallcom.2019.03.244
Zou, Hefei, Zhu, Qingsheng, Zhang, Zhefeng (2008) Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint. Journal of Alloys and Compounds, 461. 410-417 doi:10.1016/j.jallcom.2007.07.001
Sharif, Ahmed, Chan, Y.C. (2007) Investigation of interfacial reactions between Sn–Zn solder with electrolytic Ni and electroless Ni(P) metallization. Journal of Alloys and Compounds, 440. 117-121 doi:10.1016/j.jallcom.2006.09.020
 
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