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Zhang, X.F., Guo, J.D., Shang, J.K. (2008) Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn–Zn solder interconnect. Journal of Materials Research, 23 (12) 3370-3378 doi:10.1557/jmr.2008.0413

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Reference TypeJournal (article/letter/editorial)
TitleReverse polarity effect from effective charge disparity during electromigration in eutectic Sn–Zn solder interconnect
JournalJournal of Materials Research
AuthorsZhang, X.F.Author
Guo, J.D.Author
Shang, J.K.Author
Year2008 (December)Volume23
Issue12
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1557/jmr.2008.0413Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID17103694Long-form Identifiermindat:1:5:17103694:9
GUID0
Full ReferenceZhang, X.F., Guo, J.D., Shang, J.K. (2008) Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn–Zn solder interconnect. Journal of Materials Research, 23 (12) 3370-3378 doi:10.1557/jmr.2008.0413
Plain TextZhang, X.F., Guo, J.D., Shang, J.K. (2008) Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn–Zn solder interconnect. Journal of Materials Research, 23 (12) 3370-3378 doi:10.1557/jmr.2008.0413
In(2008, December) Journal of Materials Research Vol. 23 (12) Springer Science and Business Media LLC

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Liao, Chien-Neng, Chung, Chien-Ping, Chen, Wen-Tai (2005) Electromigration-induced Pb segregation in eutectic Sn–Pb molten solder. Journal of Materials Research, 20 (12) 3425-3430 doi:10.1557/jmr.2005.0420
Huang, M. L., Zhou, Q., Zhao, N., Liu, X. Y., Zhang, Z. J. (2014) Reverse polarity effect and cross-solder interaction in Cu/Sn–9Zn/Ni interconnect during liquid–solid electromigration. Journal of Materials Science, 49. 1755-1763 doi:10.1007/s10853-013-7862-z
Kuo, Shih-Ming, Lin, Kwang-Lung (2008) Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn–9Zn/Cu sandwich. Journal of Materials Research, 23 (4) 1087-1094 doi:10.1557/jmr.2008.0142
Zhang, X.F., Guo, J.D., Shang, J.K. (2009) Growth kinetics of intermetallic compounds between Sn–9Zn solder and electroplated Fe–42Ni metallization. Journal of Alloys and Compounds, 487. 776-780 doi:10.1016/j.jallcom.2009.08.064
Wei, C.C., Liu, P.C., Chen, Chih, Tu, K.N. (2008) Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes. Journal of Materials Research, 23 (7) 2017-2022 doi:10.1557/jmr.2008.0253
Guo, Fu, Liu, Qian, Ma, Limin, Zuo, Yong (2016) Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration. Journal of Materials Research, 31 (12) 1793-1800 doi:10.1557/jmr.2016.145
Lu, C.M., Shao, T.L., Yang, C.J., Chen, Chih (2004) Microstructure evolution during electromigration in eutectic SnPb solder bumps. Journal of Materials Research, 19 (8) 2394-2401 doi:10.1557/jmr.2004.0305
Zhang, X.F., Guo, J.D., Shang, J.K. (2009) Controlling intermetallic compound formation reaction between Sn and Ni–P by Zn addition. Journal of Alloys and Compounds, 479. 505-510 doi:10.1016/j.jallcom.2008.12.093
Chen, Y.H., Shao, T.L., Liu, P.C., Chen, Chih, Chou, T. (2005) Microstructural Evolution During Electromigration in Eutectic SnAg Solder Bumps. Journal of Materials Research, 20 (9) 2432-2442 doi:10.1557/jmr.2005.0291
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Chen, Hsiao-Yun, Chen, Chih (2011) Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints. Journal of Materials Research, 26 (8) 983-991 doi:10.1557/jmr.2011.25
 
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