Kino, Hisashi, Hashiguchi, Hideto, Tanikawa, Seiya, Sugawara, Youhei, Ikegaya, Shunsuke, Fukushima, Takafumi, Koyanagi, Mitsumasa, Tanaka, Tetsu (2016) Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC. Japanese Journal of Applied Physics, 55 (4) 4 doi:10.7567/jjap.55.04ec03
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC | ||
| Journal | Japanese Journal of Applied Physics | ||
| Authors | Kino, Hisashi | Author | |
| Hashiguchi, Hideto | Author | ||
| Tanikawa, Seiya | Author | ||
| Sugawara, Youhei | Author | ||
| Ikegaya, Shunsuke | Author | ||
| Fukushima, Takafumi | Author | ||
| Koyanagi, Mitsumasa | Author | ||
| Tanaka, Tetsu | Author | ||
| Year | 2016 (April 1) | Volume | 55 |
| Issue | 4 | ||
| Publisher | Japan Society of Applied Physics | ||
| DOI | doi:10.7567/jjap.55.04ec03Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 15046110 | Long-form Identifier | mindat:1:5:15046110:6 |
| GUID | 0 | ||
| Full Reference | Kino, Hisashi, Hashiguchi, Hideto, Tanikawa, Seiya, Sugawara, Youhei, Ikegaya, Shunsuke, Fukushima, Takafumi, Koyanagi, Mitsumasa, Tanaka, Tetsu (2016) Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC. Japanese Journal of Applied Physics, 55 (4) 4 doi:10.7567/jjap.55.04ec03 | ||
| Plain Text | Kino, Hisashi, Hashiguchi, Hideto, Tanikawa, Seiya, Sugawara, Youhei, Ikegaya, Shunsuke, Fukushima, Takafumi, Koyanagi, Mitsumasa, Tanaka, Tetsu (2016) Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC. Japanese Journal of Applied Physics, 55 (4) 4 doi:10.7567/jjap.55.04ec03 | ||
| In | (2016, April) Japanese Journal of Applied Physics Vol. 55 (4) Japan Society of Applied Physics | ||
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