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Kang, Yubin, Choi, Jin-Ju, Kim, Dae-Guen, Shim, Hyun-Woo (2022) The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction. Metals, 12 (8) 1245 doi:10.3390/met12081245

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Reference TypeJournal (article/letter/editorial)
TitleThe Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction
JournalMetals
AuthorsKang, YubinAuthor
Choi, Jin-JuAuthor
Kim, Dae-GuenAuthor
Shim, Hyun-WooAuthor
Year2022 (July 25)Volume12
Issue8
PublisherMDPI AG
DOIdoi:10.3390/met12081245Search in ResearchGate
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Mindat Ref. ID15203986Long-form Identifiermindat:1:5:15203986:0
GUID0
Full ReferenceKang, Yubin, Choi, Jin-Ju, Kim, Dae-Guen, Shim, Hyun-Woo (2022) The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction. Metals, 12 (8) 1245 doi:10.3390/met12081245
Plain TextKang, Yubin, Choi, Jin-Ju, Kim, Dae-Guen, Shim, Hyun-Woo (2022) The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction. Metals, 12 (8) 1245 doi:10.3390/met12081245
In(2022, August) Metals Vol. 12 (8) MDPI AG

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Islam, M.N., Chan, Y.C., Rizvi, M.J., Jillek, W. (2005) Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder. Journal of Alloys and Compounds, 400. 136-144 doi:10.1016/j.jallcom.2005.03.053
Joo, Soyeong, Shim, Hyun-Woo, Choi, Jin-Ju, Lee, Chan-Gi, Kim, Dae-Guen (2020) A Method of Synthesizing Lithium Hydroxide Nanoparticles Using Lithium Sulfate from Spent Batteries by 2-Step Precipitation Method. Korean Journal of Metals and Materials, 58 (4) 286-291 doi:10.3365/kjmm.2020.58.4.286
Osório, Wislei R., Peixoto, Leandro C., Garcia, Leonardo R., Mangelinck-Noël, Nathalie, Garcia, Amauri (2013) Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys. Journal of Alloys and Compounds, 572. 97-106 doi:10.1016/j.jallcom.2013.03.234
Sun, Jia, Liang, Huaxin, Sun, Shaofu, Hu, Juntao, Teng, Chunyu, Zhao, Lingyan, Bai, Hailong (2022) Pattern Formation by Spinodal Decomposition in Ternary Lead-Free Sn-Ag-Cu Solder Alloy. Metals, 12 (10) 1640 doi:10.3390/met12101640
Satyanarayan, , Prabhu, K.N. (2015) Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses. Materials Science Forum, 830. 265-269 doi:10.4028/www.scientific.net/msf.830-831.265
Cho, Sun-Yun, Lee, Young-Woo, Kim, Kyoo-Seok, Moon, Young-Jun, Lee, Ji-Won., Han, Hyun-Joo, Kim, Mi-Jin, Jung, Jae-Pil (2005) Reliability of Sn–8 mass%Zn–3 mass%Bi Lead-Free Solder and Zn Behavior. MATERIALS TRANSACTIONS, 46 (11). 2322-2328 doi:10.2320/matertrans.46.2322
Varanasi, Dheeraj, Pal, Manoj Kumar (2021) Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys. Powder Metallurgy and Metal Ceramics, 60 (7) 504-512 doi:10.1007/s11106-021-00262-w
Garzel, G., Kopyto, M., Zabdyr, L.A. (2014) Thermodynamic properties of the liquid Ag-Bi-Cu-Sn lead-free solder alloys. Journal of Mining and Metallurgy, Section B: Metallurgy, 50 (2). 145-148 doi:10.2298/jmmb130727015g
Wernicki, Evan, Gu, Zhiyong (2020) Effect of Sn nanoparticle additions on thermal properties of Sn-Ag-Cu lead-free solder paste. Thermochimica Acta, 690. 178642pp. doi:10.1016/j.tca.2020.178642
Zhao, Jie, Qi, Lin, Wang, Xiu-min, Wang, Lai (2004) Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder. Journal of Alloys and Compounds, 375. 196-201 doi:10.1016/j.jallcom.2003.12.005
Wan, Jingbo, Liu, Yongchang, Wei, Chen, Gao, Zhiming (2008) Effect of the addition of In on the microstructural formation of Sn–Ag–Zn lead-free solder. Journal of Alloys and Compounds, 463. 230-237 doi:10.1016/j.jallcom.2007.09.070
 
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