Vote for your favorite mineral in #MinCup25! - Sanidine vs. Hematite
It's a pair of often-overlooked classics as potassium feldspar sanidine competes with iron ore hematite.
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

Ma, Shiran, Yang, Linmei, Yang, Jiyou, Liang, Yawei (2024) Improved microstructure and strength of Sn-Ag-Cu/Cu solder joint with Mo nanoparticles addition. Materials Letters, 356. 135597 doi:10.1016/j.matlet.2023.135597

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleImproved microstructure and strength of Sn-Ag-Cu/Cu solder joint with Mo nanoparticles addition
JournalMaterials Letters
AuthorsMa, ShiranAuthor
Yang, LinmeiAuthor
Yang, JiyouAuthor
Liang, YaweiAuthor
Year2024 (February)Volume356
PublisherElsevier BV
DOIdoi:10.1016/j.matlet.2023.135597Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID16952502Long-form Identifiermindat:1:5:16952502:8
GUID0
Full ReferenceMa, Shiran, Yang, Linmei, Yang, Jiyou, Liang, Yawei (2024) Improved microstructure and strength of Sn-Ag-Cu/Cu solder joint with Mo nanoparticles addition. Materials Letters, 356. 135597 doi:10.1016/j.matlet.2023.135597
Plain TextMa, Shiran, Yang, Linmei, Yang, Jiyou, Liang, Yawei (2024) Improved microstructure and strength of Sn-Ag-Cu/Cu solder joint with Mo nanoparticles addition. Materials Letters, 356. 135597 doi:10.1016/j.matlet.2023.135597
In(2024) Materials Letters Vol. 356. Elsevier BV

See Also

These are possibly similar items as determined by title/reference text matching only.

Liang, Yawei; Yang, Linmei; Yang, Jiyou; Ren, Hao; Buren, Bayaer (2025) Inhibition of Bi segregation in Sn-58Bi/Cu solder joint by controlling the grain of Cu substrate. Materials Letters, 395. doi:10.1016/j.matlet.2025.138689
Yang, Linmei, Quan, Shanyu, Liu, Cong, Shi, Guimei (2019) Aging resistance of the Sn-Ag-Cu solder joints doped with Mo nanoparticles. Materials Letters, 253. 191-194 doi:10.1016/j.matlet.2019.06.068
Yang, Linmei, Ma, Shiran, Mu, Guowan (2021) Improvements of microstructure and hardness of lead-free solders doped with Mo nanoparticles. Materials Letters, 304. 130654pp. doi:10.1016/j.matlet.2021.130654
Yu, Chi-Yang, Lee, Joseph, Chen, Wen-Lin, Duh, Jenq-Gong (2014) Enhancement of the impact toughness in Sn–Ag–Cu/Cu solder joints via modifying the microstructure of solder alloy. Materials Letters, 119. 20-23 doi:10.1016/j.matlet.2013.12.088
Yang, L. M., Zhang, Z. F. (2015) Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint. Journal of Applied Physics, 117 (1). 15308pp. doi:10.1063/1.4905587
Chen, Wei-Yu, Yu, Chi-Yang, Duh, Jenq-Gong (2014) Improving the shear strength of Sn–Ag–Cu–Ni/Cu–Zn solder joints via modifying the microstructure and phase stability of Cu–Sn intermetallic compounds. Intermetallics, 54. 181-186 doi:10.1016/j.intermet.2014.05.023
Zhao, Guoji, Sheng, Guangmin, Xue, Haofei, Yuan, Xinjian (2012) Improved mechanical property of a Cu/Sn-9Zn-0.1Cr/Cu joint using a rapidly solidified solder. Materials Letters, 68. 129-132 doi:10.1016/j.matlet.2011.10.051
Lee, Yang-Hsien, Lee, Hwa-Teng (2007) Shear strength and interfacial microstructure of Sn–Ag–xNi/Cu single shear lap solder joints. Materials Science and Engineering: A, 444. 75-83 doi:10.1016/j.msea.2006.08.065
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko (2007) Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge. Key Engineering Materials, 353. 2033-2036 doi:10.4028/www.scientific.net/kem.353-358.2033
Yang, Zhongbao, Zhou, Wei, Wu, Ping (2014) Effects of Ni-coated carbon nanotubes addition on the microstructure and mechanical properties of Sn–Ag–Cu solder alloys. Materials Science and Engineering: A, 590. 295-300 doi:10.1016/j.msea.2013.10.008
Hu, F.Q., Zhang, Q.K., Jiang, J.J., Song, Z.L. (2018) Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction. Materials Letters, 214. 142-145 doi:10.1016/j.matlet.2017.11.127
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are © OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: September 7, 2025 09:50:37
Go to top of page