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Yang, L. M., Zhang, Z. F. (2015) Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint. Journal of Applied Physics, 117 (1). 15308pp. doi:10.1063/1.4905587

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Reference TypeJournal (article/letter/editorial)
TitleEffect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint
JournalJournal of Applied Physics
AuthorsYang, L. M.Author
Zhang, Z. F.Author
Year2015 (January 7)Volume117
Issue1
PublisherAIP Publishing
DOIdoi:10.1063/1.4905587Search in ResearchGate
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Mindat Ref. ID5200530Long-form Identifiermindat:1:5:5200530:9
GUID0
Full ReferenceYang, L. M., Zhang, Z. F. (2015) Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint. Journal of Applied Physics, 117 (1). 15308pp. doi:10.1063/1.4905587
Plain TextYang, L. M., Zhang, Z. F. (2015) Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint. Journal of Applied Physics, 117 (1). 15308pp. doi:10.1063/1.4905587
In(2015, January) Journal of Applied Physics Vol. 117 (1) AIP Publishing

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Cheng, Jinxuan, Hu, Xiaowu, Li, Qinglin, Jiang, Xiongxin (2020) Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint. Applied Physics A, 126. doi:10.1007/s00339-020-03483-9
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