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Liao, Chien-Neng, Lee, Ching-Hua (2008) Suppression of vigorous liquid Sn/Te reactions by Sn–Cu solder alloys. Journal of Materials Research, 23 (12) 3303-3308 doi:10.1557/jmr.2008.0409

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Reference TypeJournal (article/letter/editorial)
TitleSuppression of vigorous liquid Sn/Te reactions by Sn–Cu solder alloys
JournalJournal of Materials Research
AuthorsLiao, Chien-NengAuthor
Lee, Ching-HuaAuthor
Year2008 (December)Volume23
Issue12
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1557/jmr.2008.0409Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID17103689Long-form Identifiermindat:1:5:17103689:5
GUID0
Full ReferenceLiao, Chien-Neng, Lee, Ching-Hua (2008) Suppression of vigorous liquid Sn/Te reactions by Sn–Cu solder alloys. Journal of Materials Research, 23 (12) 3303-3308 doi:10.1557/jmr.2008.0409
Plain TextLiao, Chien-Neng, Lee, Ching-Hua (2008) Suppression of vigorous liquid Sn/Te reactions by Sn–Cu solder alloys. Journal of Materials Research, 23 (12) 3303-3308 doi:10.1557/jmr.2008.0409
In(2008, December) Journal of Materials Research Vol. 23 (12) Springer Science and Business Media LLC

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Lee, Ching-Hua, Chen, Wen-Tai, Liao, Chien-Neng (2011) Effect of antimony on vigorous interfacial reaction of Sn–Sb/Te couples. Journal of Alloys and Compounds, 509. 5142-5146 doi:10.1016/j.jallcom.2011.02.011
Liao, Chien-Neng, Chung, Chien-Ping, Chen, Wen-Tai (2005) Electromigration-induced Pb segregation in eutectic Sn–Pb molten solder. Journal of Materials Research, 20 (12) 3425-3430 doi:10.1557/jmr.2005.0420
Yen, Yee-Wen, Jao, Chien-Chung, Lee, Chiapyng (2006) Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag. Journal of Materials Research, 21 (12) 2986-2990 doi:10.1557/jmr.2006.0369
Liao, Chien-Neng, Huang, Yen-Chun (2010) Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium. Journal of Materials Research, 25 (2) 391-395 doi:10.1557/jmr.2010.0040
Song, Jenn Ming, Lin, Kwang Lung (2003) Behavior of intermetallics in liquid Sn–Zn–Ag solder alloys. Journal of Materials Research, 18 (9) 2060-2067 doi:10.1557/jmr.2003.0290
Allen, Sarah L., Notis, Michael R., Chromik, Richard R., Vinci, Richard P., Lewis, Daniel J., Schaefer, Robert (2004) Microstructural evolution in lead-free solder alloys: Part II. Directionally solidified Sn-Ag-Cu, Sn-Cu and Sn-Ag. Journal of Materials Research, 19 (5) 1425-1431 doi:10.1557/jmr.2004.0191
Zhang, X.F., Guo, J.D., Shang, J.K. (2008) Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn–Zn solder interconnect. Journal of Materials Research, 23 (12) 3370-3378 doi:10.1557/jmr.2008.0413
Islam, M.N., Chan, Y.C., Sharif, A. (2004) Interfacial reactions of Sn–Cu and Sn–Pb–Ag solder with Au/Ni during extended time reflow in ball grid array packages. Journal of Materials Research, 19 (10) 2897-2904 doi:10.1557/jmr.2004.0399
Kim, S.H., Yu, Jin (2010) Secondary IMC formation induced by Kirkendall voiding in Cu/Sn–3.5Ag solder joints. Journal of Materials Research, 25 (9) 1854-1858 doi:10.1557/jmr.2010.0232
Chen, Hsiao-Yun, Chen, Chih (2011) Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints. Journal of Materials Research, 26 (8) 983-991 doi:10.1557/jmr.2011.25
Wei, C.C., Liu, P.C., Chen, Chih, Tu, K.N. (2008) Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes. Journal of Materials Research, 23 (7) 2017-2022 doi:10.1557/jmr.2008.0253
 
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