Huang, Szuyu; Liu, Fachen; Mao, Ruilin; Guo, Qi; Li, Sheng; Sun, Fangyuan; Wang, Zhenzhong; Gao, Peng (2025) Direct Wafer Bonding of Silicon Carbide and Copper. ACS Applied Materials & Interfaces, 17 (19). doi:10.1021/acsami.5c00949
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Direct Wafer Bonding of Silicon Carbide and Copper | ||
| Journal | ACS Applied Materials & Interfaces | ||
| Authors | Huang, Szuyu | Author | |
| Liu, Fachen | Author | ||
| Mao, Ruilin | Author | ||
| Guo, Qi | Author | ||
| Li, Sheng | Author | ||
| Sun, Fangyuan | Author | ||
| Wang, Zhenzhong | Author | ||
| Gao, Peng | Author | ||
| Year | 2025 (May 14) | Volume | 17 |
| Issue | 19 | ||
| Publisher | American Chemical Society (ACS) | ||
| DOI | doi:10.1021/acsami.5c00949Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 18447097 | Long-form Identifier | mindat:1:5:18447097:6 |
| GUID | 0 | ||
| Full Reference | Huang, Szuyu; Liu, Fachen; Mao, Ruilin; Guo, Qi; Li, Sheng; Sun, Fangyuan; Wang, Zhenzhong; Gao, Peng (2025) Direct Wafer Bonding of Silicon Carbide and Copper. ACS Applied Materials & Interfaces, 17 (19). doi:10.1021/acsami.5c00949 | ||
| Plain Text | Huang, Szuyu; Liu, Fachen; Mao, Ruilin; Guo, Qi; Li, Sheng; Sun, Fangyuan; Wang, Zhenzhong; Gao, Peng (2025) Direct Wafer Bonding of Silicon Carbide and Copper. ACS Applied Materials & Interfaces, 17 (19). doi:10.1021/acsami.5c00949 | ||
| In | (2025, May) ACS Applied Materials & Interfaces Vol. 17 (19). American Chemical Society (ACS) | ||
References Listed
These are the references the publisher has listed as being connected to the article. Please check the article itself for the full list of references which may differ. Not all references are currently linkable within the Digital Library.
| Not Yet Imported: - journal-article : 10.1109/16.536807 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1109/TPEL.2013.2268900 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
 | |
| |
| Not Yet Imported: - proceedings-article : 10.1109/AERO.2004.1368048 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: Micromachines - journal-article : 10.3390/mi14061200 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: Materials Science in Semiconductor Processing - journal-article : 10.1016/j.mssp.2023.108052 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.24295/CPSSTPEA.2017.00017 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1109/JESTPE.2019.2951801 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1016/S0026-2714(02)00343-8 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1109/TPEL.2006.882974 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1109/JESTPE.2019.2943635 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| () | |
| Not Yet Imported: - journal-article : 10.1016/j.jmst.2021.10.058 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - proceedings-article : 10.1109/ECTC.2002.1008266 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1109/TCPMT.2010.2100432 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: Microelectronics Reliability - journal-article : 10.1016/j.microrel.2012.02.018 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: IEEE Transactions on Power Electronics - journal-article : 10.1109/TPEL.2007.900561 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: IEEE Transactions on Power Electronics - journal-article : 10.1109/TPEL.2007.900561 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| |
| Not Yet Imported: - journal-article : 10.1016/j.apt.2015.03.007 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| |
| () | |
| Not Yet Imported: - journal-article : 10.1109/TDMR.2014.2304737 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1088/2043-6262/1/4/043004 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - edited-book : 10.1002/9783527644223 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1149/05007.0139ecst If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1016/j.mne.2018.11.004 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - proceedings-article : 10.1109/ECTC51909.2023.00189 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1021/acsanm.9b02558 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Zinkle, S. J.; Snead, L. L. Thermophysical and mechanical properties of SiC/SiC composites (No. DOE/ER-0313/24). Oak Ridge National Lab (ORNL), Oak Ridge, TN (United States), 1998. | |
| |
| |
| |
| |
| |
| Not Yet Imported: Materials & Design - journal-article : 10.1016/j.matdes.2017.03.061 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: Journal of Materials Engineering and Performance - journal-article : 10.1007/s11665-023-08441-z If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| |
| () | |
| Not Yet Imported: - book : 10.1007/978-1-4419-9583-4 If you would like this item imported into the Digital Library, please contact us quoting Book ID 9781441995827 | |
| Not Yet Imported: Journal of Materials Science & Technology - journal-article : 10.1016/j.jmst.2022.12.012 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| |
| |
| Tao W.-Q. (2019) Heat Transfer | |
| |
| |
| |
| Not Yet Imported: - journal-article : 10.3390/molecules22020216 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| |
| Not Yet Imported: - journal-article : 10.1115/1.4034605 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| |
| Not Yet Imported: - journal-article : 10.1063/1.5089559 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1021/acsnano.6b03381 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1007/s10765-017-2328-1 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Li, Ruiyang, Hussain, Kamal, Liao, Michael E., Huynh, Kenny, Hoque, Md Shafkat Bin, Wyant, Spencer, Koh, Yee Rui, Xu, Zhihao, Wang, Yekan, Luccioni, Dorian P., Cheng, Zhe, Shi, Jingjing, Lee, Eungkyu, Graham, Samuel, Henry, Asegun, Hopkins, Patrick E., Goorsky, Mark S., Khan, M.Asif, Luo, Tengfei (2024) Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers. ACS Applied Materials & Interfaces, 16 (6) 8109-8118 doi:10.1021/acsami.3c16905 |
| Not Yet Imported: - journal-article : 10.1007/s10854-019-00846-8 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: - journal-article : 10.1016/j.jmatprotec.2018.01.017 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| Not Yet Imported: International Journal of Heat and Mass Transfer - journal-article : 10.1016/j.ijheatmasstransfer.2022.123628 If you would like this item imported into the Digital Library, please contact us quoting Journal ID | |
| |
| |
| |
| Harris G. L. (1995) Properties of Silicon Carbide | |
| Li, Yue-Hui, Qi, Rui-Shi, Shi, Ruo-Chen, Hu, Jian-Nan, Liu, Zhe-Tong, Sun, Yuan-Wei, Li, Ming-Qiang, Li, Ning, Song, Can-Li, Wang, Lai, Hao, Zhi-Biao, Luo, Yi, Xue, Qi-Kun, Ma, Xu-Cun, Gao, Peng (2022) Atomic-scale probing of heterointerface phonon bridges in nitride semiconductor. Proceedings of the National Academy of Sciences, 119 (8) doi:10.1073/pnas.2117027119 |
| |
| Not Yet Imported: - journal-article : 10.1088/0256-307X/40/3/036801 If you would like this item imported into the Digital Library, please contact us quoting Journal ID |
See Also
These are possibly similar items as determined by title/reference text matching only.