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Zhang, Zhenyu, Wang, Bo, Zhou, Ping, Guo, Dongming, Kang, Renke, Zhang, Bi (2016) A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors. Scientific Reports, 6. doi:10.1038/srep22466

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Reference TypeJournal (article/letter/editorial)
TitleA novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors
JournalScientific Reports
AuthorsZhang, ZhenyuAuthor
Wang, BoAuthor
Zhou, PingAuthor
Guo, DongmingAuthor
Kang, RenkeAuthor
Zhang, BiAuthor
Year2016 (April)Volume6
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1038/srep22466Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID4643755Long-form Identifiermindat:1:5:4643755:2
GUID0
Full ReferenceZhang, Zhenyu, Wang, Bo, Zhou, Ping, Guo, Dongming, Kang, Renke, Zhang, Bi (2016) A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors. Scientific Reports, 6. doi:10.1038/srep22466
Plain TextZhang, Zhenyu, Wang, Bo, Zhou, Ping, Guo, Dongming, Kang, Renke, Zhang, Bi (2016) A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors. Scientific Reports, 6. doi:10.1038/srep22466
In(2016) Scientific Reports Vol. 6. Springer Science and Business Media LLC

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Zhang, Zhenyu, Wang, Bo, Zhou, Ping, Kang, Renke, Zhang, Bi, Guo, Dongming (2016) A novel approach of chemical mechanical polishing for cadmium zinc telluride wafers. Scientific Reports, 6. doi:10.1038/srep26891
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Xie, Wenxiang, Zhang, Zhenyu, Liao, Longxing, Liu, Jie, Su, Hongjiu, Wang, Shudong, Guo, Dongming (2020) Green chemical mechanical polishing of sapphire wafers using a novel slurry. Nanoscale, 12 (44) 22518-22526 doi:10.1039/d0nr04705h
Zhang, Zhenyu, Liao, Longxing, Wang, Xinze, Xie, Wenxiang, Guo, Dongming (2020) Development of a novel chemical mechanical polishing slurry and its polishing mechanisms on a nickel alloy. Applied Surface Science, 506. 144670pp. doi:10.1016/j.apsusc.2019.144670
Zhang, Zhenyu, Cui, Junfeng, Zhang, Jiabo, Liu, Dongdong, Yu, Zhijian, Guo, Dongming (2019) Environment friendly chemical mechanical polishing of copper. Applied Surface Science, 467. 5-11 doi:10.1016/j.apsusc.2018.10.133
Zhang, Zhen Yu, Wang, Bo, Song, Ya Xing (2014) Chemical Mechanical Polishing of Soft-Brittle Cadmium Zinc Telluride Wafers Using a Developed Environment-Friendly Solution. Advanced Materials Research, 1017. 720-725 doi:10.4028/www.scientific.net/amr.1017.720
Zhang, Xiaoyu, Guo, Xingchen, Wang, Haoxiang, Kang, Renke, Gao, Shang (2023) Insight into Polishing Slurry and Material Removal Mechanism of Photoassisted Chemical Mechanical Polishing of YAG Crystals. Langmuir, 39 (38) 13668-13677 doi:10.1021/acs.langmuir.3c01824
Guo, Xiaoguang, Yuan, Song, Huang, Junxin, Chen, Chong, Kang, Renke, Jin, Zhuji, Guo, Dongming (2020) Effects of pressure and slurry on removal mechanism during the chemical mechanical polishing of quartz glass using ReaxFF MD. Applied Surface Science, 505. 144610pp. doi:10.1016/j.apsusc.2019.144610
 
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