Watch the Dallas Symposium LIVE, and fundraiser auction
Ticket proceeds support mindat.org! - click here...
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

Shen, Jun, Liu, Yongchang, Gao, Houxiu (2006) Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder. Chinese Science Bulletin, 51 (14). 1766-1770 doi:10.1007/s11434-006-2043-y

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleAbnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder
JournalChinese Science Bulletin
AuthorsShen, JunAuthor
Liu, YongchangAuthor
Gao, HouxiuAuthor
Year2006 (July)Volume51
Issue14
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s11434-006-2043-ySearch in ResearchGate
Generate Citation Formats
Mindat Ref. ID7102739Long-form Identifiermindat:1:5:7102739:3
GUID0
Full ReferenceShen, Jun, Liu, Yongchang, Gao, Houxiu (2006) Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder. Chinese Science Bulletin, 51 (14). 1766-1770 doi:10.1007/s11434-006-2043-y
Plain TextShen, Jun, Liu, Yongchang, Gao, Houxiu (2006) Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder. Chinese Science Bulletin, 51 (14). 1766-1770 doi:10.1007/s11434-006-2043-y
In(2006, July) Chinese Science Bulletin Vol. 51 (14) Springer Science and Business Media LLC

See Also

These are possibly similar items as determined by title/reference text matching only.

Shen, Jun, Liu, Yongchang, Gao, Houxiu (2006) Rapid directional solidification in Sn-Cu lead-free solder. Journal of University of Science and Technology Beijing, Mineral, Metallurgy, Material, 13 (4). 333-337 doi:10.1016/s1005-8850(06)60069-8
Shen, J., Chan, Y.C., Liu, S.Y. (2008) Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification. Intermetallics, 16 (9). 1142-1148 doi:10.1016/j.intermet.2008.06.016
Shen, J., Liu, Y. C., Gao, H. X. (2007) Formation of bulk Cu6Sn5 intermetallic compounds in Sn–Cu lead-free solders during solidification. Journal of Materials Science, 42. 5375-5380 doi:10.1007/s10853-006-0892-z
Wan, Jingbo, Liu, Yongchang, Wei, Chen, Gao, Zhiming (2008) Effect of the addition of In on the microstructural formation of Sn–Ag–Zn lead-free solder. Journal of Alloys and Compounds, 463. 230-237 doi:10.1016/j.jallcom.2007.09.070
Xia, Yanghua, Xie, Xiaoming, Xie, Xiaoming, Lu, Chuanyan (2006) Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging. Journal of Materials Science, 41. 2359-2364 doi:10.1007/s10853-006-4501-y
Xiong, Ming-yue, Zhang, Liang (2019) Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging. Journal of Materials Science, 54. 1741-1768 doi:10.1007/s10853-018-2907-y
Ji, Shunying, Shen, H. Hayley (2006) Characteristics of temporalspatial parameters in quasisolid-fluid phase transition of granular materials. Chinese Science Bulletin, 51 (6). 646-654 doi:10.1007/s11434-006-0646-y
Zhang, Xiaomei, Zhang, Yue, Gu, Yousong, Qi, Junjie, Huang, Yunhua, Liu, Juan (2006) Abnormal magnetic behavior in DMS Zn1−x MnxO nanowires. Chinese Science Bulletin, 51 (4). 490-492 doi:10.1007/s11434-006-0490-0
Gao, Feng, Cheng, Fangjie, Nishikawa, Hiroshi, Takemoto, Tadashi (2008) Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy. Materials Letters, 62. 2257-2259 doi:10.1016/j.matlet.2007.11.060
Ma, Qianli, Ning, Xinbao, Wang, Jun, Bian, Chunhua (2006) A new measure to characterize multifractality of sleep electroencephalogram. Chinese Science Bulletin, 51 (24). 3059-3064 doi:10.1007/s11434-006-2213-y
Yang, Zongqi, Li, yinü, Chen, Feng, Li, Dong, Zhang, Zhifang, Liu, Yanxin, Zheng, Dexian, Wang, Yong, Shen, Guifang (2006) Expression of human soluble TRAIL in Chlamydomonas reinhardtii chloroplast. Chinese Science Bulletin, 51 (14). 1703-1709 doi:10.1007/s11434-006-2041-0
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are © OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: August 22, 2025 19:32:31
Go to top of page