Vote for your favorite mineral in #MinCup25! - Kosmochlor vs. Azurite
It's a battle of green vs blue as rare but vibrant chromium-bearing kosmochlor up against the deep blue copper alteration mineral azurite.
Log InRegister
Quick Links : The Mindat ManualThe Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
Home PageAbout MindatThe Mindat ManualHistory of MindatCopyright StatusWho We AreContact UsAdvertise on Mindat
Donate to MindatCorporate SponsorshipSponsor a PageSponsored PagesMindat AdvertisersAdvertise on Mindat
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
Minerals by PropertiesMinerals by ChemistryAdvanced Locality SearchRandom MineralRandom LocalitySearch by minIDLocalities Near MeSearch ArticlesSearch GlossaryMore Search Options
Search For:
Mineral Name:
Locality Name:
Keyword(s):
 
The Mindat ManualAdd a New PhotoRate PhotosLocality Edit ReportCoordinate Completion ReportAdd Glossary Item
Mining CompaniesStatisticsUsersMineral MuseumsClubs & OrganizationsMineral Shows & EventsThe Mindat DirectoryDevice SettingsThe Mineral Quiz
Photo SearchPhoto GalleriesSearch by ColorNew Photos TodayNew Photos YesterdayMembers' Photo GalleriesPast Photo of the Day GalleryPhotography

Shen, J., Chan, Y.C., Liu, S.Y. (2008) Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification. Intermetallics, 16 (9). 1142-1148 doi:10.1016/j.intermet.2008.06.016

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleGrowth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification
JournalIntermetallics
AuthorsShen, J.Author
Chan, Y.C.Author
Liu, S.Y.Author
Year2008 (September)Volume16
Issue9
PublisherElsevier BV
DOIdoi:10.1016/j.intermet.2008.06.016Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7966119Long-form Identifiermindat:1:5:7966119:3
GUID0
Full ReferenceShen, J., Chan, Y.C., Liu, S.Y. (2008) Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification. Intermetallics, 16 (9). 1142-1148 doi:10.1016/j.intermet.2008.06.016
Plain TextShen, J., Chan, Y.C., Liu, S.Y. (2008) Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification. Intermetallics, 16 (9). 1142-1148 doi:10.1016/j.intermet.2008.06.016
In(2008, September) Intermetallics Vol. 16 (9) Elsevier BV

See Also

These are possibly similar items as determined by title/reference text matching only.

Shen, Jun, Liu, Yongchang, Gao, Houxiu (2006) Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder. Chinese Science Bulletin, 51 (14). 1766-1770 doi:10.1007/s11434-006-2043-y
Yu, Chi-Yang, Chen, Wei-Yu, Duh, Jenq-Gong (2012) Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging. Intermetallics, 26. 11-17 doi:10.1016/j.intermet.2012.03.046
Lee, Hwa-Teng, Chen, Yin-Fa (2011) Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder. Journal of Alloys and Compounds, 509. 2510-2517 doi:10.1016/j.jallcom.2010.11.068
Ma, H.R., Kunwar, A., Shang, S.Y., Jiang, C.R., Wang, Y.P., Ma, H.T., Zhao, N. (2018) Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows. Intermetallics, 96. 1-12 doi:10.1016/j.intermet.2018.01.022
Gain, Asit Kumar, Chan, Y.C. (2012) The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads. Intermetallics, 29. 48-55 doi:10.1016/j.intermet.2012.04.019
Ocak, Y., Aksöz, S., Maraşlı, N., Keşlioğlu, K. (2010) Experimental determination of thermal conductivity and solid–liquid interfacial energy of solid Ag3Sn intermetallic in the Sn–Ag–In ternary alloy. Intermetallics, 18 (11). 2250-2258 doi:10.1016/j.intermet.2010.07.019
Chen, Wei-Yu, Yu, Chi-Yang, Duh, Jenq-Gong (2014) Improving the shear strength of Sn–Ag–Cu–Ni/Cu–Zn solder joints via modifying the microstructure and phase stability of Cu–Sn intermetallic compounds. Intermetallics, 54. 181-186 doi:10.1016/j.intermet.2014.05.023
Tsao, L.C. (2011) Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering. Journal of Alloys and Compounds, 509. 2326-2333 doi:10.1016/j.jallcom.2010.11.010
Shen, J., Chan, Y.C. (2009) Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn–Ag–Cu solder and a Cu layer. Journal of Alloys and Compounds, 477. 909-914 doi:10.1016/j.jallcom.2008.11.015
Shen, J., Liu, Y. C., Gao, H. X. (2007) Formation of bulk Cu6Sn5 intermetallic compounds in Sn–Cu lead-free solders during solidification. Journal of Materials Science, 42. 5375-5380 doi:10.1007/s10853-006-0892-z
Huang, Jiaqiang, Zhu, Yunhui, Pan, Kunhong, Wang, Xudong, Huang, Zhaoling, Xiao, Dawei, Jiang, Hongjie (2024) Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn–52In/Cu solder joints during electromigration. Intermetallics, 168. 108252 doi:10.1016/j.intermet.2024.108252
 
and/or  
Mindat.org is an outreach project of the Hudson Institute of Mineralogy, a 501(c)(3) not-for-profit organization.
Copyright © mindat.org and the Hudson Institute of Mineralogy 1993-2025, except where stated. Most political location boundaries are © OpenStreetMap contributors. Mindat.org relies on the contributions of thousands of members and supporters. Founded in 2000 by Jolyon Ralph.
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
Privacy Policy - Terms & Conditions - Contact Us / DMCA issues - Report a bug/vulnerability Current server date and time: September 9, 2025 08:48:10
Go to top of page