| Reference Type | Journal (article/letter/editorial) |
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| Title | Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis |
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| Journal | MATERIALS TRANSACTIONS |
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| Authors | Shin, Young-Eui | Author |
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| Lee, Kyung-Woo | Author |
| Chang, Kyong-Ho | Author |
| Jung, Seung-Boo | Author |
| Jung, Jae Pil | Author |
| Year | 2001 | Volume | 42 |
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| Issue | 5 |
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| Publisher | Japan Institute of Metals |
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| DOI | doi:10.2320/matertrans.42.809Search in ResearchGate |
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| Generate Citation Formats |
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| Mindat Ref. ID | 7775900 | Long-form Identifier | mindat:1:5:7775900:5 |
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|
| GUID | 0 |
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| Full Reference | Shin, Young-Eui, Lee, Kyung-Woo, Chang, Kyong-Ho, Jung, Seung-Boo, Jung, Jae Pil (2001) Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis. MATERIALS TRANSACTIONS, 42 (5). 809-813 doi:10.2320/matertrans.42.809 |
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| Plain Text | Shin, Young-Eui, Lee, Kyung-Woo, Chang, Kyong-Ho, Jung, Seung-Boo, Jung, Jae Pil (2001) Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis. MATERIALS TRANSACTIONS, 42 (5). 809-813 doi:10.2320/matertrans.42.809 |
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| In | (2001) MATERIALS TRANSACTIONS Vol. 42 (5) Japan Institute of Metals |
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