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Shohji, Ikuo, Mori, Fuminari, Kobayashi, Kojiro F. (2001) Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders. MATERIALS TRANSACTIONS, 42 (5). 790-793 doi:10.2320/matertrans.42.790

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Reference TypeJournal (article/letter/editorial)
TitleThermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
JournalMATERIALS TRANSACTIONS
AuthorsShohji, IkuoAuthor
Mori, FuminariAuthor
Kobayashi, Kojiro F.Author
Year2001Volume42
Issue5
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.42.790Search in ResearchGate
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Mindat Ref. ID7775897Long-form Identifiermindat:1:5:7775897:2
GUID0
Full ReferenceShohji, Ikuo, Mori, Fuminari, Kobayashi, Kojiro F. (2001) Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders. MATERIALS TRANSACTIONS, 42 (5). 790-793 doi:10.2320/matertrans.42.790
Plain TextShohji, Ikuo, Mori, Fuminari, Kobayashi, Kojiro F. (2001) Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders. MATERIALS TRANSACTIONS, 42 (5). 790-793 doi:10.2320/matertrans.42.790
In(2001) MATERIALS TRANSACTIONS Vol. 42 (5) Japan Institute of Metals

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Shohji, Ikuo, Yasuda, Kiyokazu, Takemoto, Tadashi (2005) Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index. MATERIALS TRANSACTIONS, 46 (11). 2329-2334 doi:10.2320/matertrans.46.2329
Shin, Young-Eui, Lee, Kyung-Woo, Chang, Kyong-Ho, Jung, Seung-Boo, Jung, Jae Pil (2001) Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis. MATERIALS TRANSACTIONS, 42 (5). 809-813 doi:10.2320/matertrans.42.809
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